Abstract: An apparatus for supporting an axial load between first and second planes with an axial dimension therebetween includes first, second, and third members. The first member has a planar face on one end engaging the first plane and has a spherical face on the other end. The second member has a spiraling face on one end and has a spherical face on another end. The spherical face engaging the spherical face of the first member so that the first and second spherical faces maintain substantial contact for transferring the axial load between the first and second planes whether the planes are parallel or non-parallel. The third member has a spiraling face on one end and has a planar face on another end. The planar face engages the second plane. The spiraling face engages the spiraling face of the second member. The axial dimension of the second and third members can be adjusted when at least one is rotated.

Abstract: One or more chambers of a multi-chamber vacuum processing apparatus are provided with a high gas flow conductance path to an exhaust volume of the apparatus that is maintained at high vacuum with a high vacuum pump. Separate pumps for the one or more chambers are made unnecessary by providing such chambers with a protective deposition shield or shield set that is configured to substantially protect walls of the chamber and the gas flow conductance path from deposition and to partially impede the gas flow from the chamber through the gas flow conductance path to the exhaust volume so that the chamber can be operated at a higher pressure than that of the exhaust volume and the chambers can be operated at different pressures and without cross-contamination. Preferably, a nested set of chamber shields is used. A controller is programmed to control the processing of wafers in the chambers by controlling the supply of process gas into the chambers.