Patents by Inventor Robert Ruether

Robert Ruether has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPOSITION, USE THEREOF AND METHOD FOR ELECTRODEPOSITING GOLD CONTAINING LAYERS
    Publication number: 20170159195
    Abstract: The present invention relates to a composition and method for electrodepositing gold containing layers using the composition and the use of mercapto-triazole compounds as anti-immersion additives. The composition contains a mercapto-triazole compound which acts as an anti-immersion additive. The composition and method are suited for depositing functional or hard gold or gold alloys that can be applied in the industry as contact material of electrical connectors for high reliability applications.
    Type: Application
    Filed: August 21, 2015
    Publication date: June 8, 2017
    Inventors: Jana BREITFELDER, Robert RUETHER, Olaf KURTZ
  • METHOD FOR DEPOSITING THICK COPPER LAYERS ONTO SINTERED MATERIALS
    Publication number: 20160060781
    Abstract: The present invention relates to a method for electrodepositing a thick copper layer onto an electrically conductive, sintered layer. The thick copper layer has a high adhesion strength, is poor in defects and internal stress, and has high electrical and thermal conductivity. The thick copper layer on the sintered layer is suited for printed circuit boards for high power electronic applications.
    Type: Application
    Filed: May 9, 2014
    Publication date: March 3, 2016
    Inventors: Markus GLOEDEN, Herko GENTH, Nina DAMBROWSKY, Anthony MCNELLY, Robert RUETHER
  • Solution and process for increasing the solderability and corrosion resistance of a metal or metal alloy surface
    Patent number: 8491713
    Abstract: Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface.
    Type: Grant
    Filed: January 13, 2010
    Date of Patent: July 23, 2013
    Assignee: Atotech Deutschland GmbH
    Inventors: Jürgen Barthelmes, Robert Ruether, Olaf Kurtz, Jana Breitfelder
  • Ni-P layer system and process for its preparation
    Patent number: 8304658
    Abstract: The invention relates to a layer system comprising on a substrate, the surface of which has been electropolished, (i) a Ni layer having a thickness ?3.0 ?m, (ii) a Ni—P layer having a thickness ?1.0 ?m, and (iii) a Au layer having a thickness ?1.0 ?m.
    Type: Grant
    Filed: March 5, 2009
    Date of Patent: November 6, 2012
    Assignee: Atotech Deutschland GmbH
    Inventors: Juergen Barthelmes, Robert Ruether, Olaf Kurtz, Michael Danker
  • SOLUTION AND PROCESS FOR INCREASING THE SOLDERABILITY AND CORROSION RESISTANCE OF A METAL OR METAL ALLOY SURFACE
    Publication number: 20110281124
    Abstract: Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface.
    Type: Application
    Filed: January 13, 2010
    Publication date: November 17, 2011
    Inventors: Jürgen Barthelmes, Robert Ruether, Olaf Kurtz, Jana Breitfelder
  • NI-P LAYER SYSTEM AND PROCESS FOR ITS PREPARATION
    Publication number: 20100326713
    Abstract: The invention relates to a layer system comprising on a substrate, the surface of which has been electropolished, (i) a Ni layer having a thickness ?3.0 ?m, (ii) a Ni—P layer having a thickness ?1.0 ?m, (iii) a Au layer having a thickness ?1.0 ?m.
    Type: Application
    Filed: March 5, 2009
    Publication date: December 30, 2010
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Juergen Barthelmes, Robert Ruether, Olaf Kurtz, Michael Danker
  • Stable, electroless, aqueous, acidic gold bath for depositing gold and the use thereof
    Patent number: 5322552
    Abstract: Stable, electroless, aqueous acidic gold bath, containing the tetracyano-(III) anion, a complexing agent, or a mixture of several complexing agents, and an acid, or a mixture of acids, and the use of these baths for the deposition of gold on metals which are less noble than gold or on alloys of these metals.
    Type: Grant
    Filed: April 2, 1993
    Date of Patent: June 21, 1994
    Assignee: Schering, AG
    Inventors: Manfred Dettke, Robert Ruether, Klaus Janotta