Abstract: A high-density optical connector for demountable coupling to an external component having a fiber block that includes a body supporting a 2-D array of optical fibers, a 2-D array of microlenses aligned with the optical fibers for beam shaping, a coupling surface having passive alignment demountable coupling features matching complementary coupling features on a receptacle associated with the external connection point to be coupled, wherein the coupling surface comprises an optical region aligned with the microlens array and the optical fiber array permitting passage of light to and from optical fibers, with the demountable coupling features distributed adjacent the optical region in reference to the microlens array and optical fiber, and wherein the demountable coupling features are symmetrically arranged about at least one of two orthogonal axes of optical region.

Abstract: Attaching an optical connector to an optoelectronic device via a foundation thereon is achieved by kinematic coupling, quasi-kinematic coupling, or elastic-averaging coupling. The foundation is attached to the optoelectronic device with reference to optical ports in the optoelectronic device. For kinematic coupling, coupling balls and grooves are provided on facing surfaces of the optical connector and the foundation. An optical bench of the optical connector is positioned in a central space on the foundation. A preload is applied along a line through the thermal center of the coupled foundation and optical connector without introducing lateral bias, ensuring the contact between the foundation and optical connector.

Abstract: An optical coupling between an optical fiber and a grating coupler having a design angle, in the form of an optical bench having a structured reflective surface at which incident light is directed. The optical bench supports the optical fiber in optical alignment with respect to the structured reflective surface. The optical fiber is a single-mode fiber. The structured reflective surface turns light transmitted between the grating coupler and the optical fiber and includes a three-dimensional concave reflective surface profile that is structured to reshape the light transmitted between the grating coupler and the optical fiber to produce a mode field that matches the optical fiber input/output and the design angle of the grating coupler.

Abstract: To couple light between an optical fiber and a grating coupler of a photonic integrated circuits, a mirror is provided to turn light to/from the optical fiber to allow the axis of the optical fiber to be oriented at small angles or parallel to the surface of the PIC, and lowered close to the surface of the PIC. The mirror is further configured to reshape light from a flat polished optical fiber to produce a mode field resembling the mode field of an angled polished optical fiber, to match the design angle of existing grating couplers that are designed to work with angled polished optical fibers. The mirror and optical fiber alignment structure in the optical connector are integrally/simultaneous formed by precision stamping.

Abstract: Optical alignment of a receptacle at an aligned position on an optoelectronic device body is accomplished using an alignment optical connector that is demountably attached to the receptacle by matching passive alignment features on the facing surfaces between the receptacle and the alignment optical connector. The device body includes a first row of at least two data optical ports, and a second row of alignment input and output ports parallel to and spaced from the first row of data optical ports by a parallel spacing. The data optical ports communicate with the optoelectronic device. The alignment ports correspond to a loopback waveguide. The aligned position of the receptacle is determined from the loopback waveguide. The receptacle is permanently attached to the device body at this aligned position.

Abstract: An optical fiber array module that can accommodate variations in diameters of the optical fibers in the fiber array within anticipated tolerance, to accurately and securely retain the optical fibers in grooves in the module without using any solder interface or epoxy interface between the optical fibers and the supporting components. The fiber array module of the present invention relies on elasto-plastic interfaces for mechanical deformation, as opposed to solder reflow or epoxy curing, to accommodate variations in diameters of the optical fibers in the fiber array as supported in grooves between a substrate and a cover.

Abstract: A passive optical alignment coupling between two bodies each having a complementary interstitial two-dimensional planar array of protrusions defining an array of interstices. Each array of protrusions defines an array of discrete protrusions separated and isolated from one another on the surface of the corresponding bodies. When the bodies are pressed together, the array of protrusions defined on one body intermesh with protrusions defined on the other body with protrusions of one body received in corresponding interstices defined on the other body. The protrusion surfaces of each adjacent pair of protrusions are in point contact. The first body is removably attachable to the second body to define a demountable coupling, with the first array of alignment features against the second array of alignment features to define an elastic averaging coupling, thereby passively aligning the first body to the second body.

Abstract: An optical connector module having a plurality of discrete optical benches inputting/outputting optical signals, each including: a base defining an array of reflective surfaces and supporting an array of optical fiber array defining optical channels with inputs/outputs in optical alignment with corresponding reflective surfaces, thereby forming optical inputs/outputs of the corresponding optical bench. A carrier commonly supports the optical benches, with the optical benches fixedly mount thereon in a desired spatial arrangement with the optical inputs/outputs of the optical benches matching optical inputs/outputs of the external optical component. The carrier is structured to physically connect to the external component.

Abstract: A hermetic optical fiber alignment assembly includes a ferrule portion having a plurality of grooves receiving the end sections of optical fibers, wherein the grooves define the location and orientation of the end sections with respect to the ferrule portion. The assembly includes an integrated optical element for coupling the input/output of an optical fiber to the opto-electronic devices in the opto-electronic module. The optical element can be in the form of a structured reflective surface. The end of the optical fiber is at a defined distance to and aligned with the structured reflective surface. The structured reflective surfaces and the fiber alignment grooves can be formed by stamping.

Abstract: A demountable connection of an optical connector using a foundation having features for integrated optical coupling and demountable coupling. The foundation provides for demountable passive alignment connection to an optical connector. The foundation is permanently attached and aligned to a PIC chip. The foundation includes optical elements that redirect and reshape incident light to follow a desired light beam shape and path between the optical connector and the optoelectronic device. The foundation may include a combination of different optical elements having optical properties that produces the desired light beam quality and direction. The foundation also includes passive alignment features that matches the passive alignment features on the facing side of the optical connector. The foundation has a unitary, monolithic body that is provided with the optical elements and the passive alignment features.

Abstract: An LBM package and method for packaging an LBM using a stamped metallic mirror array that folds light beams, correct beam shapes, fold and/or redirect beam propagations. The mirror array can be integrated or assembled inside an LBM to provide beam shaping and redirection of the high-power beams near the laser diode. The LBM incorporates a stamped metallic freeform mirror or reflector with an off-axis parabolic shape is configured to fold and collimate laser beam. A precision stamping process is deployed to produce an array of miniature, freeform mirrors in high volume applications. The mirror array simplifies the optical path and eliminates passive components such as refractive lenses and dichroic filters that combine RGB beams. Stamped metallic optical components with micro-scale freeform mirrors in the LBM are tolerant of high temperatures and can thermally diffuse heat away from the reflective surface for high power applications.

Abstract: A passive optical alignment coupling between an optical connector having a first two-dimensional planar array of alignment features and a foundation having a second two-dimensional planar array of alignment features. One of the arrays is a network of orthogonally intersecting longitudinal grooves defining an array of discrete protrusions that are each in a generally pyramidal shape with a truncated top separated from one another by the orthogonally intersecting longitudinal grooves, and the other array is a network of longitudinal cylindrical protrusions. The cylindrical protrusions are received in the grooves, with protrusion surfaces of the cylindrical protrusions in contact with groove surfaces and the top of the discrete protrusions contacting the surface bound by the cylindrical protrusions.

Abstract: An optical bench subassembly including an integrated photonic device. Optical alignment of the photonic device with the optical bench can be performed outside of an optoelectronic package assembly before attaching thereto. The photonic device is attached to a base of the optical bench, with its optical input/output in optical alignment with the optical output/input of the optical bench. The optical bench supports an array of optical fibers in precise relationship to a structured reflective surface. The photonic device is mounted on a submount to be attached to the optical bench. The photonic device may be actively or passively aligned with the optical bench. After achieving optical alignment, the submount of the photonic device is fixedly attached to the base of the optical bench. The optical bench subassembly may be structured to be hermetically sealed as a hermetic feedthrough, to be hermetically attached to a hermetic optoelectronic package.

Abstract: An optical fiber array module that can accommodate variations in diameters of the optical fibers in the fiber array within anticipated tolerance, to accurately and securely retain the optical fibers in grooves in the module without using any solder interface or epoxy interface between the optical fibers and the supporting components. The fiber array module of the present invention relies on elasto-plastic interfaces for mechanical deformation, as opposed to solder reflow or epoxy curing, to accommodate variations in diameters of the optical fibers in the fiber array as supported in grooves between a substrate and a cover.

Abstract: A passive optical alignment coupling between an optical connector having a first two-dimensional planar array of alignment features and a foundation having a second two-dimensional planar array of alignment features. One of the arrays is a network of orthogonally intersecting longitudinal grooves defining an array of discrete protrusions that are each in a generally pyramidal shape with a truncated top separated from one another by the orthogonally intersecting longitudinal grooves, and the other array is a network of longitudinal cylindrical protrusions. The cylindrical protrusions are received in the grooves, with protrusion surfaces of the cylindrical protrusions in contact with groove surfaces and the top of the discrete protrusions contacting the surface bound by the cylindrical protrusions.

Abstract: A passive optical alignment coupling between an optical connector having a first two-dimensional planar array of alignment features and a foundation having a second two-dimensional planar array of alignment features. One of the arrays is a network of orthogonally intersecting longitudinal grooves defining an array of discrete protrusions that are each in a generally pyramidal shape with a truncated top separated from one another by the orthogonally intersecting longitudinal grooves, and the other array is a network of longitudinal cylindrical protrusions. The cylindrical protrusions are received in the grooves, with protrusion surfaces of the cylindrical protrusions in contact with groove surfaces and the top of the discrete protrusions contacting the surface bound by the cylindrical protrusions.

Abstract: To couple light between an optical fiber and a grating coupler of a photonic integrated circuits, a mirror is provided to turn light to/from the optical fiber to allow the axis of the optical fiber to be oriented at small angles or parallel to the surface of the PIC, and lowered close to the surface of the PIC. The mirror is further configured to reshape light from a flat polished optical fiber to produce a mode field resembling the mode field of an angled polished optical fiber, to match the design angle of existing grating couplers that are designed to work with angled polished optical fibers. The mirror and optical fiber alignment structure in the optical connector are integrally/simultaneous formed by precision stamping.

Abstract: A passive optical alignment coupling between an optical connector having a first two-dimensional planar array of alignment features and a foundation having a second two-dimensional planar array of alignment features. One of the arrays is a network of orthogonally intersecting longitudinal grooves defining an array of discrete protrusions that are each in a generally pyramidal shape with a truncated top separated from one another by the orthogonally intersecting longitudinal grooves, and the other array is a network of longitudinal cylindrical protrusions. The cylindrical protrusions are received in the grooves, with protrusion surfaces of the cylindrical protrusions in contact with groove surfaces and the top of the discrete protrusions contacting the surface bound by the cylindrical protrusions.

Abstract: An edge coupler having an optical bench with a mirror array. Each mirror bends, reflects and/or reshapes incident light. The edge coupler is optically coupled to the optical elements in a PIC chip which direct light to the edge of the PIC chip. The edge coupler provides a demountable, passively aligned coupling between an optical fiber array and the PIC chip. The edge coupler may be a free space edge coupler without any optical element between the mirror array and the optical elements of the PIC chip, or may include grooves each receiving a section of optical fiber with its longitudinal axis along the first light path and terminating substantially at or extending beyond the edge of the edge coupler. The optical fiber array may include an optical fiber connector terminating and supporting the ends of the optical fibers in optical alignment with the mirror array of the edge coupler.

Abstract: An optical bench subassembly including an integrated photonic device. Optical alignment of the photonic device with the optical bench can be performed outside of an optoelectronic package assembly before attaching thereto. The photonic device is attached to a base of the optical bench, with its optical input/output in optical alignment with the optical output/input of the optical bench. The optical bench supports an array of optical fibers in precise relationship to a structured reflective surface. The photonic device is mounted on a submount to be attached to the optical bench. The photonic device may be actively or passively aligned with the optical bench. After achieving optical alignment, the submount of the photonic device is fixedly attached to the base of the optical bench. The optical bench subassembly may be structured to be hermetically sealed as a hermetic feedthrough, to be hermetically attached to a hermetic optoelectronic package.