Abstract: In a semiconductor wafer processing apparatus, the support rails carrying the boats holding wafers are at least partially supported during insertion into and withdrawal from the furnace by one or more tiltable support brackets. Each bracket has two spaced pillars connected at their bases by a first member which is hingedly connected to a second member attached to a base surface of the furnace apparatus. A rotatable shaft extends between the top ends of the pillars. A projection extends from the first member. In use, as the furnace end plate is moved toward the furnace tube, pushing in the rails, the end plate folds down the, or each bracket as it contacts it. The projection passes up behind the end plate on folding down of a bracket. On reverse movement of the end plate, away from the furnace tube, the end plate contacts a projection and tilts up the related bracket. If a plurality of brackets are provided they are successively tilted up, back to a support position.