Abstract: An assembly comprises a first subassembly, a second subassembly, and a conductive grounding element. The first subassembly comprises a first module comprising a first ground plane and a first conductive region in operable communication with the first ground plane. The second subassembly comprises a second module comprising a second ground plane distinct from the first ground plane and a second conductive region in operable communication with the second ground plane. The first and second subassemblies attach to each other along a seam. The conductive grounding element comprises an electrically conductive material including a first portion disposed adjacent to the first conductive region and a second portion disposed adjacent the second conductive region. The conductive grounding element is configured to fill one or more gaps in the seam and to operably couple together the first and second ground planes of the first and second subassemblies into a third common ground plane.

Abstract: An assembly comprises a first subassembly, a second subassembly, and a conductive grounding element. The first subassembly comprises a first module comprising a first ground plane and a first conductive region in operable communication with the first ground plane. The second subassembly comprises a second module comprising a second ground plane distinct from the first ground plane and a second conductive region in operable communication with the second ground plane. The first and second subassemblies attach to each other along a seam. The conductive grounding element comprises an electrically conductive material including a first portion disposed adjacent to the first conductive region and a second portion disposed adjacent the second conductive region. The conductive grounding element is configured to fill one or more gaps in the seam and to operably couple together the first and second ground planes of the first and second subassemblies into a third common ground plane.

Abstract: Methods and apparatus for providing a wideband dual differential current loop radiator. In embodiments, a radiator includes first and second dipole pairs with first and second differential conductor pairs providing differential signals to the first and second dipole arms. The radiator may include a cavity, which can be filed with air, in at least a portion of a feed layer. The dipoles may have a coincident phase center.

Abstract: Methods and apparatus for providing a wideband dual differential current loop radiator. In embodiments, a radiator includes first and second dipole pairs with first and second differential conductor pairs providing differential signals to the first and second dipole arms. The radiator may include a cavity, which can be filed with air, in at least a portion of a feed layer. The dipoles may have a coincident phase center.

Abstract: In one aspect, a unit cell of a phased array antenna includes a printed wiring board (PWB). The PWB includes a first layer comprising a radiator, a second layer comprising a feed circuit configured to provide excitation signals to the radiator, a plurality of vias connecting the feed circuit to the radiator, a signal layer, an active component layer comprising an active component bonded to the signal layer and a radio frequency (RF) connector connecting the signal layer to the feed circuit.

Abstract: Guanella topology balun/unun impedance transformer contains cascaded, i.e., series-coupled, coils of different sizes implemented in RF CMOS technology. The cascading of differently-sized coils provides for a large resonance-free operating bandwidth. The shunt inductive loading maximizes low frequency performance.

Abstract: Guanella topology balun/unun impedance transformer contains cascaded, i.e., series-coupled, coils of different sizes implemented in RF CMOS technology. The cascading of differently-sized coils provides for a large resonance-free operating bandwidth. The shunt inductive loading maximizes low frequency performance.

Abstract: In one aspect, a unit cell of a phased array antenna includes a metal plate having a hole, a first side and a second side opposite the first side, a first plurality of laminate layers disposed on the first side, a second plurality of layers disposed on the second side of the metal plate, a radiator disposed in the first plurality of layer on the first side, a feed circuit disposed in the second plurality of laminate layers on the second side and configured to provide excitation signals to the radiator and a first plurality of vias extending through the hole connecting the feed circuit to the radiator.

Abstract: Described is a radio frequency (RF) array antenna element provided from a multi-layer printed circuit board (PCB) having disposed thereon a plurality of dual-polarized antenna elements with each of the dual-polarized antenna elements disposed to define a segmentation cut plane therebetween to enable size modification and modular construction of the RF array antenna.

Abstract: A wideband dual-polarized current loop antenna element is provided having a ground tower and an antenna circuit integrated, such as within a multi-layer circuit board configuration. The antenna circuit includes feed conductors and element conductors, each of which are capacitively coupled to a top ground plane of the ground tower. The feed conductors are coupled to receive signals from coaxial feed lines coupled to the respective antenna element and element conductors are coupled to receive signals from adjacent antenna elements, such as in an antenna array configuration. The antenna element can further include one or more frequency selective surface (FSS) layers disposed proximate to the top ground plane of the ground tower and the antenna circuit. The ground tower, antenna circuit and one or more FSS layers can be formed to provide a low-profile antenna element having wide broadband performance.

Abstract: In accordance with the concepts, systems, methods and techniques described herein a tripole current loop radiating element is provided having three conductors disposed on a substrate with the three conductors being physically spaced apart from each other and arranged to be responsive to radio frequency (RF) signals at a desired frequency range. Each of the three conductors includes a ground via to couple the respective conductor to a ground plane and a signal via to receive RF signals from a single feed circuit. The feed circuit includes a signal port, and first, second and third antenna ports, with each of the antenna ports coupled to a respective one of the three conductors. The feed circuit can provide the RF signals to each of the three conductors having equal amplitudes and distributed with relative phases of 0°/120°/240° respectively (i.e., phase shifted by 120° from an adjacent conductor).

Abstract: A wideband dual-polarized current loop antenna element is provided having a ground tower and an antenna circuit integrated, such as within a multi-layer circuit board configuration. The antenna circuit includes feed conductors and element conductors, each of which are capacitively coupled to a top ground plane of the ground tower. The feed conductors are coupled to receive signals from coaxial feed lines coupled to the respective antenna element and element conductors are coupled to receive signals from adjacent antenna elements, such as in an antenna array configuration. The antenna element can further include one or more frequency selective surface (FSS) layers disposed proximate to the top ground plane of the ground tower and the antenna circuit. The ground tower, antenna circuit and one or more FSS layers can be formed to provide a low-profile antenna element having wide broadband performance.

Abstract: In accordance with the concepts, systems, methods and techniques described herein a tripole current loop radiating element is provided having three conductors disposed on a substrate with the three conductors being physically spaced apart from each other and arranged to be responsive to radio frequency (RF) signals at a desired frequency range. Each of the three conductors includes a ground via to couple the respective conductor to a ground plane and a signal via to receive RF signals from a single feed circuit. The feed circuit includes a signal port, and first, second and third antenna ports, with each of the antenna ports coupled to a respective one of the three conductors. The feed circuit can provide the RF signals to each of the three conductors having equal amplitudes and distributed with relative phases of 0°/120°/240° respectively (i.e., phase shifted by 120° from an adjacent conductor).

Abstract: In one aspect, a unit cell of a phased array antenna includes a metal plate having a hole, a first side and a second side opposite the first side, a first plurality of laminate layers disposed on the first side, a second plurality of layers disposed on the second side of the metal plate, a radiator disposed in the first plurality of layer on the first side, a feed circuit disposed in the second plurality of laminate layers on the second side and configured to provide excitation signals to the radiator and a first plurality of vias extending through the hole connecting the feed circuit to the radiator.

Abstract: In one aspect, a unit cell of a phased array antenna includes a printed wiring board (PWB). The PWB includes a first layer comprising a radiator, a second layer comprising a feed circuit configured to provide excitation signals to the radiator, a plurality of vias connecting the feed circuit to the radiator, a signal layer, an active component layer comprising an active component bonded to the signal layer and a radio frequency (RF) connector connecting the signal layer to the feed circuit.

Abstract: An electronic stripline circuit includes a flexible dielectric film having a three-dimensional coiled shape that defines a spiraled inner core. At least one electrically conductive signal trace is formed on a first surface of the flexible dielectric film. The signal trace extends along a signal path to define a trace length configured to control a time delay of a coiled time delay unit.

Abstract: Methods and apparatus for a dual polarized thumbtack radiator having enhanced dissipation. In embodiments, a power divider resistor for a balun is coupled directly to ground plane blocks that provide a RF shield. An attachment mechanism, such as a screw secures the thumbtack assembly to an aperture plate and provides thermal and electrical connection.

Abstract: Methods and apparatus for a dual polarized thumbtack radiator having enhanced dissipation. In embodiments, a power divider resistor for a balun is coupled directly to ground plane blocks that provide a RF shield. An attachment mechanism, such as a screw secures the thumbtack assembly to an aperture plate and provides thermal and electrical connection.

Abstract: A dual polarization current loop radiator realized with a via, probe, or exposed coaxial feed using part of a vertical metal structure of the radiator to guide current to a feed point of a horizontal metal plate capacitively coupled to the vertical metal structure is described. The vertical metal structure may be either stamped and attached to the ground plane or it can be formed along with metal backplane structure of the radiator. The top of the vertical metal piece is separated from the horizontal metal plate by a predetermined distance dielectric spacing. The spacing may be realized either a thin dielectric core or a non-conductive adhesive material.

Abstract: A transition apparatus for connecting first and second circuit boards is provided. The transition apparatus includes a beam having edges and a length defined between the edges, beam circuitry running along the length of the beam and connections disposed at the edges of the beam to connect the beam circuitry with respective circuitry of the first and second circuit boards at respective interior, opposing surfaces thereof.