Patents by Inventor Robert S. Pauley
Robert S. Pauley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10573354Abstract: Approaches, techniques, and mechanisms are disclosed for manufacturing and operating high density memory systems. The high density memory systems can increase the amount of memory available to a computing system by allowing the connection of multiple memory modules into a single memory interface on a motherboard via a memory adapter as described herein.Type: GrantFiled: September 22, 2016Date of Patent: February 25, 2020Assignee: SMART Modular Technologies, Inc.Inventors: Satyanarayan Shivkumar Iyer, Robert S. Pauley, Jr.
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Patent number: 9939855Abstract: A method of manufacture of an enhanced capacity memory system includes: providing a dual in-line memory module carrier having a memory module and an integrated memory buffer coupled to the memory module; coupling a memory expansion board, having a supplementary memory module, to the dual in-line memory module carrier including attaching a bridge transposer; and providing a system interface connector coupled to the integrated memory buffer and the bridge transposer for controlling the memory module, the supplementary memory module, or a combination thereof.Type: GrantFiled: November 16, 2015Date of Patent: April 10, 2018Assignee: SMART Modular Technologies, Inc.Inventors: Victor Mahran, Robert S. Pauley, Jr.
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Publication number: 20180081554Abstract: Approaches, techniques, and mechanisms are disclosed for manufacturing and operating high density memory systems. The high density memory systems can increase the amount of memory available to a computing system by allowing the connection of multiple memory modules into a single memory interface on a motherboard via a memory adapter as described herein.Type: ApplicationFiled: September 22, 2016Publication date: March 22, 2018Inventors: Satyanarayan Shivkumar Iyer, Robert S. Pauley, JR.
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Patent number: 9648754Abstract: A system and method of manufacture of an integrated circuit device system includes: a module interposer having a module first side and a module second side; an outer chip assembly mounted to the module first side; a mirrored chip assembly mounted to the module second side, the mirrored chip assembly below the outer chip assembly; and a carrier attached to the module second side, the carrier includes a carrier first side and a carrier second side, the mirrored chip assembly suspended above the carrier first side.Type: GrantFiled: March 31, 2014Date of Patent: May 9, 2017Assignee: SMART Modular Technologies, Inc.Inventors: Satyanarayan Shivkumar Iyer, Robert S. Pauley, Jr., Victor Mahran
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Publication number: 20160070316Abstract: A method of manufacture of an enhanced capacity memory system includes: providing a dual in-line memory module carrier having a memory module and an integrated memory buffer coupled to the memory module; coupling a memory expansion board, having a supplementary memory module, to the dual in-line memory module carrier including attaching a bridge transposer; and providing a system interface connector coupled to the integrated memory buffer and the bridge transposer for controlling the memory module, the supplementary memory module, or a combination thereof.Type: ApplicationFiled: November 16, 2015Publication date: March 10, 2016Inventors: Victor Mahran, Robert S. Pauley, JR.
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Patent number: 9204550Abstract: A method of manufacture of an enhanced capacity memory system includes: providing a dual in-line memory module carrier having a memory module and an integrated memory buffer coupled to the memory module; coupling a memory expansion board, having a supplementary memory module, to the dual in-line memory module carrier including attaching a bridge transposer; and providing a system interface connector coupled to the integrated memory buffer and the bridge transposer for controlling the memory module, the supplementary memory module, or a combination thereof.Type: GrantFiled: October 1, 2012Date of Patent: December 1, 2015Assignee: SMART Modular Technologies, Inc.Inventors: Victor Mahran, Robert S. Pauley, Jr.
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Patent number: 8971045Abstract: A module is electrically connectable to a computer system. The module includes an edge connector with a plurality of electrical contacts electrically connectable to the computer system, at least one layer of thermally conductive material thermally coupled to the edge connector, and first and second printed circuit boards each having a plurality of integrated circuit components that are electrically coupled to the edge connector and thermally coupled to the at least one layer of thermally conductive material. The at least one layer of thermally conductive material are disposed between the first and second printed circuit boards.Type: GrantFiled: December 30, 2012Date of Patent: March 3, 2015Assignee: NETLIST, Inc.Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
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Patent number: 8379391Abstract: A memory module with attached transposer and interposers to provide additional surface area for the placement of memory devices is disclosed. The memory module includes a memory board with a first surface, a second surface and an edge with a set of electrical contacts. A transposer is attached to each surface of the memory board, and an interposer is attached to each transposer on the opposite surface of the transposer from the memory board. The interposer has space to allow placement of memory devices on both a first surface between the interposer and the memory board, and on a second surface of the interposer away from the memory board.Type: GrantFiled: May 13, 2009Date of Patent: February 19, 2013Assignee: Smart Modular Technologies, Inc.Inventors: Mike H. Amidi, Robert S. Pauley, Satyanarayan Shivkumar Iyer
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Patent number: 8345427Abstract: A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the second surface. The second surface faces the first surface. The module further includes at least one thermal conduit positioned between the first surface and the second surface. The at least one thermal conduit is in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages.Type: GrantFiled: November 4, 2010Date of Patent: January 1, 2013Assignee: Netlist, Inc.Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
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Publication number: 20110110047Abstract: A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the second surface. The second surface faces the first surface. The module further includes at least one thermal conduit positioned between the first surface and the second surface. The at least one thermal conduit is in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages.Type: ApplicationFiled: November 4, 2010Publication date: May 12, 2011Applicant: Netlist, Inc.Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
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Patent number: 7839645Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first surface and a first plurality of circuits coupled to the first surface. The first plurality of circuits is in electrical communication with the electrical contacts. The module further includes a second surface and a second plurality of circuits coupled to the second surface. The second plurality of circuits is in electrical communication with the electrical contacts. The second surface faces the first surface. The module further includes at least one thermally conductive layer positioned between the first surface and the second surface. The at least one thermally conductive layer is in thermal communication with the first plurality of circuits, the second plurality of circuits, and a first set of the plurality of electrical contacts.Type: GrantFiled: October 26, 2009Date of Patent: November 23, 2010Assignee: Netlist, Inc.Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
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Publication number: 20100110642Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first surface and a first plurality of circuits coupled to the first surface. The first plurality of circuits is in electrical communication with the electrical contacts. The module further includes a second surface and a second plurality of circuits coupled to the second surface. The second plurality of circuits is in electrical communication with the electrical contacts. The second surface faces the first surface. The module further includes at least one thermally conductive layer positioned between the first surface and the second surface. The at least one thermally conductive layer is in thermal communication with the first plurality of circuits, the second plurality of circuits, and a first set of the plurality of electrical contacts.Type: ApplicationFiled: October 26, 2009Publication date: May 6, 2010Applicant: Netlist, Inc.Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
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Patent number: 7630202Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first substrate which has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second substrate which has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second substrate faces the first surface of the first substrate. The module further includes at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components.Type: GrantFiled: March 20, 2008Date of Patent: December 8, 2009Assignee: Netlist, Inc.Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
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Publication number: 20090279243Abstract: A memory module with attached transposer and interposers to provide additional surface area for the placement of memory devices is disclosed. The memory module includes a memory board with a first surface, a second surface and an edge with a set of electrical contacts. A transposer is attached to each surface of the memory board, and an interposer is attached to each transposer on the opposite surface of the transposer from the memory board. The interposer has space to allow placement of memory devices on both a first surface between the interposer and the memory board, and on a second surface of the interposer away from the memory board.Type: ApplicationFiled: May 13, 2009Publication date: November 12, 2009Inventors: Mike H. Amidi, Robert S. Pauley, Satyanarayan Shivkumar Iyer
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Publication number: 20080316712Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first substrate which has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second substrate which has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second substrate faces the first surface of the first substrate. The module further includes at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components.Type: ApplicationFiled: March 20, 2008Publication date: December 25, 2008Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
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Patent number: 7375970Abstract: A module is electrically connectable to a computer system. The module includes at least one multilayer structure having a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first printed circuit board coupled to the at least one multilayer structure. The first printed circuit board has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second printed circuit board coupled to the at least one multilayer structure. The second printed circuit board has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second printed circuit board faces the first surface of the first printed circuit board.Type: GrantFiled: July 9, 2007Date of Patent: May 20, 2008Assignee: Netlist, Inc.Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
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Patent number: 7254036Abstract: A module is electrically connectable to a computer system. The module includes a frame having an edge connector with a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first printed circuit board coupled to the frame. The first printed circuit board has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is electrically coupled to the electrical contacts of the edge connector. The module further includes a second printed circuit board coupled to the frame. The second printed circuit board has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is electrically coupled to the electrical contacts of the edge connector. The second surface of the second printed circuit board faces the first surface of the first printed circuit board.Type: GrantFiled: April 7, 2005Date of Patent: August 7, 2007Assignee: Netlist, Inc.Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
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Patent number: 6930903Abstract: Integrated circuits utilizing standard commercial packaging are arranged on a printed circuit board to allow the production of 1-Gigabyte and 2-Gigabyte capacity memory modules. A first row of integrated circuits is oriented in an opposite orientation to a second row of integrated circuits. The integrated circuits in a first half of the first row and in the corresponding half of the second row are connected via a signal trace to a first register. The integrated circuits in a second half of the first row and in the corresponding half of the second row are connected to a second register. Each register processes a non-contiguous subset of the bits in each data word.Type: GrantFiled: January 27, 2004Date of Patent: August 16, 2005Assignee: Netlist, Inc.Inventors: Jayesh R. Bhakta, Robert S. Pauley, Jr.
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Patent number: 6930900Abstract: Integrated circuits utilizing standard commercial packaging are arranged on a printed circuit board to allow the production of 1-Gigabyte and 2-Gigabyte capacity memory modules. A first row of integrated circuits is oriented in an opposite orientation to a second row of integrated circuits. The integrated circuits in a first half of the first row and in the corresponding half of the second row are connected via a signal trace to a first register. The integrated circuits in a second half of the first row and in the corresponding half of the second row are connected to a second register. Each register processes a non-contiguous subset of the bits in each data word.Type: GrantFiled: January 27, 2004Date of Patent: August 16, 2005Assignee: Netlist, Inc.Inventors: Jayesh R. Bhakta, Robert S. Pauley, Jr.
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Patent number: 6873534Abstract: Integrated circuits utilizing standard commercial packaging are arranged on a printed circuit board to allow the production of 1-Gigabyte and 2-Gigabyte capacity memory modules. A first row of integrated circuits is oriented in an opposite orientation to a second row of integrated circuits. The integrated circuits in a first half of the first row and in the corresponding half of the second row are connected via a signal trace to a first register. The integrated circuits in a second half of the first row and in the corresponding half of the second row are connected to a second register. Each register processes a non-contiguous subset of the bits in each data word.Type: GrantFiled: January 30, 2004Date of Patent: March 29, 2005Assignee: Netlist, Inc.Inventors: Jayesh R. Bhakta, Robert S. Pauley, Jr.