Patents by Inventor Robert S. Pokrzywa

Robert S. Pokrzywa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5530291
    Abstract: An electronic package including a base member and associated cover member designed for being positioned together to compress at least two circuitized substrates (e.g., a ceramic substrate and a plurality of flexible substrates) positioned therein. One of the substrates is substantially rigid and is positively positioned in a protected, aligned manner within the base. Additionally, the flexible substrates are precisely aligned and initially secured to the rigid substrate, the invention further using yet another resilient means to act against each of the flexible substrates when the packages fully assemble. The cover is secured to the base to effect final compression of the internal elements. This package may be positioned on and electrically coupled to another circuitized substrate, e.g., PCB.
    Type: Grant
    Filed: June 1, 1995
    Date of Patent: June 25, 1996
    Assignee: International Business Machines Corporation
    Inventors: Benson Chan, Fletcher L. Chapin, Vincent M. Fiacco, John R. Mankus, Robert S. Pokrzywa
  • Patent number: 5468996
    Abstract: An electronic package including a base member and associated cover member designed for being positioned together to compress at least two circuitized substrates (e.g., a ceramic substrate and a plurality of flexible substrates) positioned therein. One of the substrates is substantially rigid and is positively positioned in a protected, aligned manner within the base. Additionally, the flexible substrates are precisely aligned and initially secured to the rigid substrate, the invention further using yet another resilient means to act against each of the flexible substrates when the packages are fully assembled. The cover is secured to the base to effect final compression of the internal elements. This package may be positioned on and electrically coupled to another circuitized substrate, e.g., PCB.
    Type: Grant
    Filed: March 25, 1994
    Date of Patent: November 21, 1995
    Assignee: International Business Machines Corporation
    Inventors: Benson Chan, Fletcher L. Chapin, Vincent M. Fiacco, John R. Mankus, Robert S. Pokrzywa
  • Patent number: 4900274
    Abstract: A keying system for assuring the proper sequence or arrangement of cable cards within a card grouper is provided. The grouper includes a plurality of slots to receive the cable cards. The cards include tab means at at least one side thereof which can be selectively trimmed to one of several specific extension distances from the card. The grouper includes a template which has grooves configured to receive cards having their tabs programmed to one and only one configuration. Thus any given card, when programmed, will fit in only one location. The cards and grouper also include coacting surfaces to allow the appropriate card to be inserted in only one orientation in any given slot.
    Type: Grant
    Filed: December 15, 1988
    Date of Patent: February 13, 1990
    Assignee: International Business Machines Corporation
    Inventors: Fernand J. Dorleans, Robert O. Norton, Robert S. Pokrzywa