Patents by Inventor Robert S. Pyles

Robert S. Pyles has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting device packages with improved heat transfer
    Patent number: 8598602
    Abstract: Packages containing one or more light emitting devices, such as light emitting diodes (LEDs), are disclosed. In one embodiment, LED package can include a thermal element having improved solder reliability to improve heat dissipation capacity of the LED package. LED package can include a molded plastic body having one or more LEDs attached to one or more electrical elements. The LEDs can be connected to an upper surface of the thermal element. The thermal element can include a bottom surface which can extend further away in distance from a body of the LED package than a bottom surface of the electrical element. This configuration can result in an improved connection between the LED package and an external circuitry source, thereby increasing heat transfer ability of the LED package.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: December 3, 2013
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Sung Chul Joo, Robert S. Pyles
  • LIGHT EMITTING DEVICE PACKAGES WITH IMPROVED HEAT TRANSFER
    Publication number: 20110031865
    Abstract: Packages containing one or more light emitting devices, such as light emitting diodes (LEDs), are disclosed. In one embodiment, LED package can include a thermal element having improved solder reliability to improve heat dissipation capacity of the LED package. LED package can include a molded plastic body having one or more LEDs attached to one or more electrical elements. The LEDs can be connected to an upper surface of the thermal element. The thermal element can include a bottom surface which can extend further away in distance from a body of the LED package than a bottom surface of the electrical element. This configuration can result in an improved connection between the LED package and an external circuitry source, thereby increasing heat transfer ability of the LED package.
    Type: Application
    Filed: June 28, 2010
    Publication date: February 10, 2011
    Inventors: Christopher P. Hussell, Sung Chul Joo, Robert S. Pyles