Abstract: Handheld and stationary hot air solder reflow apparatus for repairing, reworking or producing electronic components and circuit boards of the type having a means for supplying a flow of hot air to an outlet tube are provided with a nozzle adaptor which has an internal adapter body which is resiliently carries a support collar which is held in an axial direction relative to the internal body by a spring. A bezel ring having a plurality of receiving tabs is mounted in the support collar, the tabs on the bezel ring in the support collar engage tabs on a mounting plate of each nozzle assembly, causing compression of the spring and resulting in a clamping of the mounting plate between a bottom surface of the internal body and the bezel ring.

Abstract: A handheld low voltage machining tool with which any one or more of drilling, milling, and abrading operations can be safely performed even on densely populated, multilayer, circuit boards. Provisions are made for preventing electrical overstress by isolating the tip of the machining tool from the drive motor as well as for preventing abrupt starting of the tool which can cause jerking, jumping or skipping of the tool off of the target. Still further, dynamic braking of the tool bit is achieved, both upon release of an operator actuated control switch and due to a selected conductive layer being reached. For the latter effect, a probe is provided by which a low voltage can be delivered to a component or conductor on the board, and circuitry detects grounding of this voltage by contact with the grounded bit of the machining tool.

Abstract: A tweezer-type heating device for installation and removal device of electronic components with respect to a substrate, such as for SMC installation and through hole installation or removal. More specifically, a handheld tweezer-type heating device is provided in which a wide variety of different sized (and shaped) tips can be used with a high degree of accuracy in terms of thermo/mechanical contact. Tolerances in the parts of the handpiece, the assembly, the heaters and the tips that may bring the bottom edges of the tips out of their alignment plane are very easily corrected with an adjustable hinge which, by loosening of a screw and sliding the parts with respect to each other, allows proper alignment to be achieved. Still further, a thumb screw is provided at the back of the handpiece to allow the gap between the tips to be slightly opened or closed. This is useful in accommodating tolerances in the components.

Abstract: Apparatus for soldering and desoldering an electronic component to or from a printed circuit board includes an alignment station and a soldering/desoldering station. The printed circuit board is mounted upon an adjusable X-Y table which can be indexed between the alignment station and the soldering/desoldering station. To align an electronic component with respect to th PCB, a vacuum pickup device is operated at the alignment station to pickup and support the component within an optical field of view above the PCB and the X-Y table is adjusted in X, Y and .theta. directions with respect to the component. Upon alignment of the component, the pickup device is lowered to temporarily adhere the component to the PCB by an adhesive flux. Thereafter, the X-Y table is indexed to a preset position below a hot air soldering nozzle and the component soldered in a known manner. A rotary device for shearing a defective electronic device from a PCB is also attached to the bottom of the soldering/desoldering nozzle.

Abstract: This invention relates to a method and apparatus for removing and installing surface mounted devices (SMD's) with respect to a substrate such as a printed circuit board (PCB).

Abstract: A cleaning unit for cleaning the tip of a soldering iron or solder extractor or the like, the unit including a well for containing a liquid which will shock surface oxides from the tip; a sponge disposed within the well for absorbing the liquid, the sponge having an opening extending therethrough; and a nonmetallic, preferably porous liner in contact with the surface of the opening in the sponge, the nonmetallic liner having an abrasive surface whereby particulate matter may be removed from the tip by the abrasive surface by rubbing the tip thereagainst and said surface oxides may be removed by being brought into contact with the liquid absorbed in the sponge.

Abstract: A X-Y table is disclosed having a table rotatably mounted on a base for movement in the X-Y and .theta. directions. The device includes fine adjustments in both X and Y directions and a quick shear mechanism with means for automatically returning the table to its original position after the quick shear procedure. The table may be used as a stand above unit or particularly for use in installing and removing components from printed circuit boards.