Patents by Inventor Robert S. Soloff

Robert S. Soloff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8950458
    Abstract: An ultrasonic tool having a sonotrode having a single weld region and two nodal regions formed on either side of the weld region. Two rigid mount boosters are each coupled to either side of the weld region. One transducer is coupled to one of the rigid mount boosters. Two ultrasonic stack mounting rings are each configured to be coupled to a housing assembly at a non-nodal region and coupled to one of the rigid mount boosters at a nodal region.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: February 10, 2015
    Assignee: Sonics & Materials Inc.
    Inventors: Michael Patrikios, Robert S. Soloff, Sigfredo Vargas, Sr.
  • Publication number: 20130284379
    Abstract: An ultrasonic tool having a sonotrode having a single weld region and two nodal regions formed on either side of the weld region. Two rigid mount boosters are each coupled to either side of the weld region. One transducer is coupled to one of the rigid mount boosters. Two ultrasonic stack mounting rings are each configured to be coupled to a housing assembly at a non-nodal region and coupled to one of the rigid mount boosters at a nodal region.
    Type: Application
    Filed: April 27, 2012
    Publication date: October 31, 2013
    Inventors: Michael Patrikios, Robert S. Soloff, Sigfredo Vargas, SR.
  • Patent number: 8212171
    Abstract: A system for ultrasonic assisted electrical discharge machining of a component part having a longitudinal axis, a half wavelength resonant frequency along the longitudinal axis and an attachment portion, is provided. The system includes an ultrasonic horn having a longitudinal axis, a half wavelength resonant frequency along the longitudinal axis and an attachment portion. The half wavelength resonant frequency of the ultrasonic horn is the same as the half wavelength resonant frequency of the component part. Additionally, one of the attachment portion of the component part and the attachment portion of the ultrasonic horn is a male part and the other one of the attachment portion of the component part and the attachment portion of the ultrasonic horn is a female part sized and shaped to mate and engage one another when the component part and the ultrasonic horn are at generally the same temperature.
    Type: Grant
    Filed: December 26, 2007
    Date of Patent: July 3, 2012
    Assignee: Sonics & Materials Inc.
    Inventor: Robert S. Soloff
  • Publication number: 20090166335
    Abstract: A system for ultrasonic assisted electrical discharge machining of a component part having a longitudinal axis, a half wavelength resonant frequency along the longitudinal axis and an attachment portion, is provided. The system includes an ultrasonic horn having a longitudinal axis, a half wavelength resonant frequency along the longitudinal axis and an attachment portion. The half wavelength resonant frequency of the ultrasonic horn is the same as the half wavelength resonant frequency of the component part. Additionally, one of the attachment portion of the component part and the attachment portion of the ultrasonic horn is a male part and the other one of the attachment portion of the component part and the attachment portion of the ultrasonic horn is a female part sized and shaped to mate and engage one another when the component part and the ultrasonic horn are at generally the same temperature.
    Type: Application
    Filed: December 26, 2007
    Publication date: July 2, 2009
    Inventor: Robert S. Soloff
  • Patent number: 6814824
    Abstract: A fabric having a backing layer with a lower surface, at least a portion of the backing layer adjacent the lower surface being formed from a thermoplastic material, is provided. At least the lower surface of the backing layer is heated in order to soften the lower surface of the backing layer, and a die having a surface in which are formed a plurality of recesses is forced into the softened lower surface of the backing layer in order to create a plurality of raised areas protruding from the lower surface of the backing layer. The fabric is placed on the substrate so that the raised areas protruding from the lower surface of the backing layer are in intimate pressurized contact with the substrate at an interface thereof, and a vibration or orbital welding process is performed thereon to achieve a bond therebetween.
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: November 9, 2004
    Assignee: Sonics & Materials, Inc.
    Inventor: Robert S. Soloff
  • Publication number: 20040112502
    Abstract: A fabric having a backing layer with a lower surface, at least a portion of the backing layer adjacent the lower surface being formed from a thermoplastic material, is provided. At least the lower surface of the backing layer is heated in order to soften the lower surface of the backing layer, and a die having a surface in which are formed a plurality of recesses is forced into the softened lower surface of the backing layer in order to create a plurality of raised areas protruding from the lower surface of the backing layer. The fabric is placed on the substrate so that the raised areas protruding from the lower surface of the backing layer are in intimate pressurized contact with the substrate at an interface thereof, and a vibration or orbital welding process is performed thereon to achieve a bond therebetween.
    Type: Application
    Filed: September 26, 2003
    Publication date: June 17, 2004
    Inventor: Robert S. Soloff
  • Patent number: 6227275
    Abstract: A method for vibration or orbital welding of a fabric to a thermoplastic substrate includes forming an assembly which has a decorative outer face without markings or pin dents that need to be removed or brushed out. The fabric can be woven or non-woven material and usually is characterized by high and low density regions that are bonded to a thermoplastic substrate in a vibration welder having a smooth surfaced platen applying pressure to the exposed surface of the fabric. High quality bonds or vibration welds are obtained between a fabric and a thermoplastic substrate characterized by a textured surface having tiny raised regions.
    Type: Grant
    Filed: February 7, 2000
    Date of Patent: May 8, 2001
    Assignee: Sonics & Mateials, Inc.
    Inventors: Floyd H. Dibble, Robert S. Soloff
  • Patent number: 6066217
    Abstract: A method for vibration or orbital welding of a fabric to a thermoplastic substrate includes forming an assembly which has a decorative outer face without markings or pin dents that need to be removed or brushed out. The fabric can be woven or non-woven material and usually is characterized by high and low density regions that are bonded to a thermoplastic substrate in a vibration welder having a smooth surfaced platen applying pressure to the exposed surface of the fabric. High quality bonds or vibration welds are obtained between a fabric and a thermoplastic substrate characterized by a textured surface having tiny raised regions.
    Type: Grant
    Filed: June 24, 1999
    Date of Patent: May 23, 2000
    Assignee: Sonics & Materials, Inc.
    Inventors: Floyd H. Dibble, Robert S. Soloff