Abstract: A cover for surrounding both an electronic device and a support on which the electronic device is retained includes a first portion defining a back of the cover to be positioned behind the electronic device and behind the support. The first portion includes at least one aperture for receiving a mounting member configured to mount the support to a structure. The cover further includes a second portion defining a front of the cover. The second portion defines therein a cavity sized and configured such that when connected to the first portion about an outer periphery of the second portion, the cavity encloses the electronic device and the support. A heating element is coupled to the second portion and operable to heat the cavity.