Patents by Inventor Robert-Scott Melendrino Lopez

Robert-Scott Melendrino Lopez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inkjet printhead assembly having planarized mounting layer for printhead dies
    Patent number: 6543880
    Abstract: A method of forming an inkjet printhead assembly includes providing a substrate, disposing a planarization layer on a face of the substrate such that a first surface of the planarization layer contacts the face of the substrate, mechanically planarizing a second surface of the planarization layer opposite the first surface, including reducing a thickness of at least a portion of the first planarization layer, and mounting a plurality of printhead dies on the second surface of the planarization layer.
    Type: Grant
    Filed: August 25, 2000
    Date of Patent: April 8, 2003
    Assignee: Hewlett-Packard Company
    Inventors: Mohammad Akhavain, Robert-Scott Melendrino Lopez, Brian J. Keefe, Janis Horvath, Joseph E. Scheffelin, David K. Mc Elfresh
  • Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding
    Patent number: 6476346
    Abstract: The disclosure describes a method for predicting and avoiding bad bonds or connections when performing electrical connection of two electrical conductors by using a laser light beam attached to an optical fiber system which directs the light to the spot to be bonded. The method provides for rapid detection of damaged optical fibers before bad bonds or connections occur. Disclosed is a method for predicting and avoiding bad bonds or connections when performing solderless electrical connection of two contact elements by using a laser light beam attached to a optical fiber system which directs the light to the spot to be bonded.
    Type: Grant
    Filed: May 21, 2001
    Date of Patent: November 5, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Mohammad Akhavain, Say-Teng Lai, Robert-Scott Melendrino Lopez
  • Coplanar mounting of printhead dies for wide-array inkjet printhead assembly
    Patent number: 6409307
    Abstract: An inkjet printhead assembly includes a substrate having a non-planar surface and a plurality of adhesive quantities each disposed on the non-planar surface of the substrate. As such, a plurality of printhead dies are each adhered to the non-planar surface of the substrate by one of the adhesive quantities. A thickness of at least one of the adhesive quantities varies from the thickness of another of the adhesive quantities such that the thickness of the adhesive quantities compensates for the non-planar surface of the substrate. Thus, the adhesive quantities support the printhead dies and establish a substantially coplanar relationship among the printhead dies.
    Type: Grant
    Filed: February 14, 2001
    Date of Patent: June 25, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Mohammad Akhavain, Robert-Scott Melendrino Lopez, Dale Dean Timm, Jr., Janis Horvath, Noah Carl Lassar, David McElfresh, Brian J. Keefe, Joseph E. Scheffelin
  • Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding
    Publication number: 20020000427
    Abstract: The disclosure describes a method for predicting and avoiding bad bonds or connections when performing electrical connection of two electrical conductors by using a laser light beam attached to an optical fiber system which directs the light to the spot to be bonded. The method provides for rapid detection of damaged optical fibers before bad bonds or connections occur. Disclosed is a method for predicting and avoiding bad bonds or connections when performing solderless electrical connection of two contact elements by using a laser light beam attached to a optical fiber system which directs the light to the spot to be bonded.
    Type: Application
    Filed: May 21, 2001
    Publication date: January 3, 2002
    Inventors: Mohammad Akhavain, Say-Teng Lai, Robert-Scott Melendrino Lopez
  • Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding
    Patent number: 6236015
    Abstract: The disclosure describes a method for predicting and avoiding bad bonds or connections when performing electrical connection of two electrical conductors by using a laser light beam attached to an optical fiber system which directs the light to the spot to be bonded. The method provides for rapid detection of damaged optical fibers before bad bonds or connections occur. Disclosed is a method for predicting and avoiding bad bonds or connections when performing solderless electrical connection of two contact elements by using a laser light beam attached to a optical fiber system which directs the light to the spot to be bonded.
    Type: Grant
    Filed: October 31, 1998
    Date of Patent: May 22, 2001
    Assignee: Hewlett-Packard Company
    Inventors: Mohammad Akhavain, Say-Teng Lai, Robert-Scott Melendrino Lopez