Abstract: A spinning ride system adapted to convert kinetic energy to electrical energy onboard each of its vehicles. The system includes a passenger vehicle with a chassis for receiving a passenger. The system includes a ride structure including a support arm supporting the passenger vehicle, and the ride structure moves the support arm along a ride path. The system includes a mounting sleeve statically attached to the chassis and pivotally coupled to the support arm. A user input mechanism is attached to the mounting sleeve adapted to receive user input forces to cause the chassis to have movements relative to the support arm. The system includes an electrical component provided on or in the chassis and includes a kinetic energy conversion assembly with an electrical generator converting kinetic energy of the chassis during the movements (e.g., spinning) to electrical energy used to power the electrical component.

Abstract: An electronic structure, and associated method of fabrication, that includes a substrate having attached circuit elements and conductive bonding pads of varying thickness. Pad categories relating to pad thickness include thick pads (17 to 50 microns), medium pads (10-17 microns), and thin pads (3 to 10 microns). A thick pad is used for coupling a ball grid array (BGA) to a substrate with attachment of the BGA to a circuit card. A medium pad is useful in flip-chip bonding of a chip to a substrate by use of an interfacing small solder ball. A thin copper pad, coated with a nickel-gold layer, is useful for coupling a chip to a substrate by use of a wirebond interface. The electrical structure includes an electrical coupling of two pads having different thickness, such that the pads are located either on the same surface of a substrate or on-opposite sides of a substrate.

Abstract: Embedded flush circuitry features are provided by providing a carrier foil having an electrically conductive layer therein and coating the electrically conductive layer with a dielectric material. Circuitry features are formed in the dielectric material and conductive metal is plated to fill the circuitry features.