Abstract: Methods of improving the bondability of thermoplastic plastic substrates are described. In the methods, a bondable substrate is adhered to a thermoplastic plastic material of choice through mechanical, thermal, or chemical procedures, resulting in bond-enhanced thermoplastic materials. In one example, a urethane honeycomb panel with bond enhancement substrates is described. Thermoplastic panels with bond enhancement layers are laminated to secondary materials such as metal or plastic by applying an adhesive to the bond enhancement layer and adhering the secondary material.