Abstract: A fluid matrix display is disclosed which is a reflective display that utilizes four colored dyes to create an image. Each of the dyes corresponds to one color in a CMYK color space. Each individually addressable pixel element of the fluid matrix display is composed of four-stacked pixel chambers. Images are created by writing appropriate colored dye data into each pixel chambers of each pixel element of the fluid matrix display. Each pixel chamber is valved to admit or expunge the colored dye to and from that pixel chamber. The admitting and expunging is controlled by the use of electrorhelogic fluids, which provides for a relatively simple switching arrangement to activate and deactivate the pixel assemblies.

Abstract: A structure embodying a switch and method of operating thereof for creating a latching switch is disclosed. The latching switch utilizes an electrorheologic fluid and the electronic latch function thereof is actuated by a pressure signal and deactivated by the removal of both the pressure signal and a holding voltage.

Abstract: A fluid matrix display is disclosed which is a reflective display that utilizes four colored dyes to create an image. Each of the dyes corresponds to one color in the CMYK color space. Each individually addressable pixel element of the fluid matrix display is composed of four-stacked pixel chambers. Each pixel chamber is valved to admit or expunge the colored dye to and from that pixel chamber. Images are created by writing appropriate colored dye data into each pixel chambers of each pixel element of the fluid matrix display.

Abstract: Electromigration testing is accelerated in the batch fabrication of semiconductor integrated circuits by forming test structures during the metal deposition phase of the batch fabrication process. Test metal lines can be formed on steps etched in a silicon oxide insulating layer with the vertical walls of the steps being greater than twice the thickness of the deposited metal whereby metal is not deposited on the side walls. Alternatively, test lines in the deposit metal layer can be formed by laser ablation or by ultrasound erosion. In another embodiment, electromigration tests are performed directly on the deposit metal layer through use of spaced elongated electrical contacts placed on the deposited metal layer surface. The elongated contacts can be wires of known diameter and length, or the elongated contacts can comprise a plurality of point contacts.

Abstract: Electromigration testing is accelerated in the batch fabrication of semiconductor integrated circuits by forming test structures during the metal deposition phase of the batch fabrication process. Test metal lines can be formed on steps etched in a silicon oxide insulating layer with the vertical walls of the steps being greater than twice the thickness of the deposited metal whereby metal is not deposited on the side walls. Alternatively, test lines in the deposit metal layer can be formed by laser ablation or by ultrasound erosion. In another embodiment, electromigration tests are performed directly on the deposit metal layer through use of spaced elongated electrical contacts placed on the deposited metal layer surface. The elongated contacts can be wires of known diameter and length, or the elongated contacts can comprise a plurality of point contacts.

Abstract: A socket for use in testing packaged integrated circuits having leads depending therefrom includes a first member for receiving the integrated circuit package and having a plurality of holes for receiving leads extending from the package. A second member has a plurality of wire contacts for engaging the leads, the first and second members being arranged to permit relative lateral translation thereof. A cam is provided for sliding the first member relative to the second member and moving leads extending through the holes in the first member into engagement with the contacts of the second member. A socket for dual in-line integrated circuit package (DIP) has two rows of holes in the first member, and two slots are provided in the second member each aligned with a row of holes. The wire contacts extend across each slot. For high temperature operation (greater than 250° C.) the first and second members comprise anodized aluminum or a ceramic, and the wires comprise Monel or other high temperature material.

Abstract: A heater has two, hollow, half-cylindrical heat guides fastened to each other at one side by an articulated connector and at the other side by a bolted joint. Internal surfaces of the heat guides represent the shape of the object being heated. On external surfaces of the heat guides, there are a series of, preferably flat splines. Lamellar heating elements are fastened to the splines. Mutual adherence surfaces of the heating elements and splines are shaped according to geometrical patterns, the appropriate selection of which changes the thermal characteristics of the heater over a wide range. The heater may be supplied from single- or three-phase mains. The heater is applicable especially for heating the cylinders, nozzles and tools of injection moulding and extrusion machines.