Abstract: Selective discharging of a rechargeable battery pack across a power supply system load is provided, which includes determining occurrence of a condition within the power supply system, the power supply system including a power supply circuit and a backup energy source. The power supply circuit receives main input power, and the backup energy source is operatively coupled to the power supply circuit to supply backup power to the system load when main power input to the power supply circuit is unavailable. Based on determining occurrence of the condition within the power supply system, a controller actively discharges a rechargeable battery pack of the backup energy source. The actively discharging includes controlling the power supply circuit to force discharging of power from the rechargeable battery pack to the power supply system load by suspending the main input power within the system from powering the system load.

Abstract: A method for the thermal treatment of a component, in particular a metal powder injection molded component (MIM component) including a nickel base alloy, wherein, after sintering, in particular immediately after sintering, in the injection molding process, the component is exposed for a predetermined holding time to at least one treatment temperature below the sintering temperature. A component, in particular an MIM component, and to an aircraft engine.

Abstract: A system for growing plants includes a water circulation system connecting a plurality of deep water culture tanks in series and/or in parallel through which water is provided to plants housed in the tanks; a nanobubble generator for oxygenating the water; and a water cooling and disinfecting apparatus.

Abstract: Labeled probes, and methods of use thereof, comprise a Cas polypeptide conjugated to gRNA that is specific for target nucleic acid sequences, including genomic DNA sequences. The probes and methods can be used to label nucleic acid sequences without global DNA denaturation.

Abstract: Labeled probes, and methods of use thereof, comprise a Cas polypeptide conjugated to gRNA that is specific for target nucleic acid sequences, including genomic DNA sequences. The probes and methods can be used to label nucleic acid sequences without global DNA denaturation. The presently-disclosed subject matter meets some or all of the above identified needs, as will become evident to those of ordinary skill in the art after a study of information provided in this document.

Abstract: Labeled probes, and methods of use thereof, comprise a Cas polypeptide conjugated to gRNA that is specific for target nucleic acid sequences, including genomic DNA sequences. The probes and methods can be used to label nucleic acid sequences without global DNA denaturation.

Abstract: A method for the thermal treatment of a component, in particular a metal powder injection molded component (MIM component) including a nickel base alloy, wherein, after sintering, in particular immediately after sintering, in the injection molding process, the component is exposed for a predetermined holding time to at least one treatment temperature below the sintering temperature. A component, in particular an MIM component, and to an aircraft engine.

Abstract: Labeled probes, and methods of use thereof, comprise a Cas polypeptide conjugated to gRNA that is specific for target nucleic acid sequences, including genomic DNA sequences. The probes and methods can be used to label nucleic acid sequences without global DNA denaturation. The presently-disclosed subject matter meets some or all of the above identified needs, as will become evident to those of ordinary skill in the art after a study of information provided in this document.

Abstract: A filter press having a plurality of stackable filter plate assemblies comprises at least one turbidity sensing module [20, 220, 320, 420] coupled to a first filter plate assembly [1] within the plurality of stackable filter plate assemblies. The turbidity sensing module [20, 220, 320, 420] is generally positioned between a filtrate drain opening [8a-d] communicating with a filter chamber [14], and either a filtrate port [7, 13] or filtrate discharge tube [4g, 15], in order to determine a level of turbidity of filtrate [50] exiting said first filter plate assembly. Turbidity levels may be determined independently of turbidity levels of filtrate [50] exiting other filter plate assemblies [1] within the filter press. When turbidity levels reach a predetermined threshold, and alarm [80] is activated, which informs an operator of the need to replace a filter cloth associated with the affected filter plate assembly [1].

Abstract: A filter press having a plurality of stackable filter plate assemblies comprises at least one turbidity sensing module [20, 220, 320, 420] coupled to a first filter plate assembly [1] within the plurality of stackable filter plate assemblies. The turbidity sensing module [20, 220, 320, 420] is generally positioned between a filtrate drain opening [8a-d] communicating with a filter chamber [14], and either a filtrate port [7, 13] or filtrate discharge tube [4g, 15], in order to determine a level of turbidity of filtrate [50] exiting said first filter plate assembly. Turbidity levels may be determined independently of turbidity levels of filtrate [50] exiting other filter plate assemblies [1] within the filter press. When turbidity levels reach a predetermined threshold, and alarm [80] is activated, which informs an operator of the need to replace a filter cloth associated with the affected filter plate assembly [1].

Abstract: A germanium containing nickel-based solder having a similar composition to a nickel-based superalloy is provided. As a result of which the proportion of ?? formed in the solder is reduced. The solder also includes chromium, cobalt, molybdenum, tungsten, aluminum, and titanium. A component including the solder is also provided.

Abstract: Cobalt-based solder alloys are proposed. The cobalt-based solder alloys have germanium. The germanium has a higher melting point than nickel-based alloys such that the germanium is used advantageously for repairing or treating components having the nickel-based alloys used at high temperatures. The components are repaired or treated by soldering using the cobalt-based solder alloys.

Abstract: Many known solder alloys according to prior art utilize silicon or boron as melting point reducers, which, however, form brittle phases that have an undesirable effect on the thermo-mechanical properties. The invention relates to a solder ally that comprises gallium and/or germanium, preferably forms the Y? phase and has improved mechanical properties.

Abstract: Cobalt-based solder alloys are proposed. The cobalt-based solder alloys have germanium. The germanium has a higher melting point than nickel-based alloys such that the germanium is used advantageously for repairing or treating components having the nickel-based alloys used at high temperatures. The components are repaired or treated by soldering using the cobalt-based solder alloys.

Abstract: A germanium containing nickel-based solder having a similar composition to a nickel-based superalloy is provided. As a result of which the proportion of ?? formed in the solder is reduced. The solder also includes chromium, cobalt, molybdenum, tungsten, aluminum, and titanium. A component including the solder is also provided.

Abstract: In one aspect, a repair method for repairing components comprising a base material with a directed microstructure is provided. The repair is performed in such a way that the repaired location correspondingly has a directed microstructure like the surrounding base material. A solder is applied in the region of a location to be repaired and is soldered to the component via heat exposure, a temperature gradient, i.e., for instance a temperature variation from a higher temperature to a lower temperature, is thereby produced in the region of the location to be repaired.

Abstract: The invention relates to a method for repairing components that consist of a superalloy. The method comprises the following steps: a solder material is applied to the repair site; the repair site with the applied solder material is heated until the latter melts; and the melted solder material is left to solidify. A powder blend, whose average composition corresponds to the component alloy constitutes the solder material, the blend comprising at least one elementary powder of the component alloy as one powder type and/or a pre-alloy of the component alloy.

Abstract: The invention relates to a method for repairing components comprising a base material with an oriented microstructure, wherein the repair point comprises a correspondingly oriented microstructure as the surrounding base material. According to the inventive method, solder is applied in the region of a point which is to be repaired and is soldered to the component by means of a heating effect produced by a device. A temperature gradient, i.e., approximately a temperature characteristic, is produced during the heating effect, said temperature characteristic ranging from a high to a low temperature in the region of the point which is to be repaired.

Abstract: A method for the repair of a component by a solder is disclosed. The method is performed under specifically selected vacuum conditions in order to prevent oxidation and vaporization.

Abstract: A method for the repair of a component by a solder is disclosed. The method is performed under specifically selected vacuum conditions in order to prevent oxidation and vaporization.