Abstract: A process for placing a circuit array on a sheet having adhesive during a pick and place operation in which a vacuum is used during its placement to minimize air bubbles between the adhesive layer and the circuit array.

Abstract: A sheet with registration holes cut in it is mounted to a surface of a pallet so that its registration holes are held taught by the outer diameter of bushings while an inner diameter pin shaft of the bushings is used by registration pins during multiple manufacturing process to provide registration of the sheet.

Abstract: An embedded electronic device and a method for manufacturing the same wherein the embedded electronic device is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board having a plurality of standoffs on the bottom surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a core layer positioned between the top surface of the printed circuit board and the top overlay.

Abstract: An embedded electronic device and a method for manufacturing the same wherein the embedded electronic device is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board having a plurality of standoffs on the bottom surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a core layer positioned between the top surface of the printed circuit board and the top overlay.

Abstract: An embedded electronic device and a method for manufacturing the same wherein the embedded electronic device is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board having a plurality of standoffs on the bottom surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a core layer positioned between the top surface of the printed circuit board and the top overlay.

Abstract: The disclosed pre-lamination core and the method of making such a pre-lamination core includes an electronic component or a non-electronic component, a bottom cover sheet, a top cover sheet, and a layer of thermosetting material between the bottom and top cover sheets. The pre-lamination core can be used in the manufacture of cards while using conventional equipment to apply top and bottom overlays to the pre-lamination core.

Abstract: A method for adhering an electronic assembly to a bottom cover sheet in the manufacture of an electronic device is presented. According to the method, the electronic assembly is attached to the bottom overlay using a modified ultra violet (“UV”) cured adhesive.

Abstract: The disclosed pre-lamination core and the method of making such a pre-lamination core includes an electronic component or a non-electronic component, a bottom cover sheet, a top cover sheet, and a layer of thermosetting material between the bottom and top cover sheets. The pre-lamination core can be used in the manufacture of cards while using conventional equipment to apply top and bottom overlays to the pre-lamination core.

Abstract: One embodiment of the invention relates to an electronic card containing a clear display window. The electronic card includes a printed circuit board, having a top surface and a bottom surface and a plurality of circuit components including a display disposed on the top surface of the printed circuit board. The electronic card further includes a bottom overlay disposed on the bottom surface of the printed circuit board, a top overlay disposed above the top surface of the printed circuit board, and a core layer positioned between the top surface of the bottom overlay and the bottom surface of the top overlay. The top overlay comprises a display window aligned with the display.

Abstract: A RFID bracelet and a method for manufacturing the same wherein the bracelet is composed of a bottom layer having a top surface and a bottom surface, a radio frequency identification microprocessor attached to the top surface of the bottom layer, an antenna, operably coupled to the radio frequency identification microprocessor and attached to the top surface of the bottom layer, a core layer, positioned above the bottom layer and attached to the bottom layer, the radio frequency identification microprocessor and the antenna and a top layer, positioned above the core layer and attached to the core layer.

Abstract: Advanced Smart Cards and similar form factors (e.g. documents, tags) having high quality external surfaces of Polyvinylchloride (PVC), Polycarbonate (PC), synthetic paper or other suitable material can be made with highly sophisticated electronic components (e.g. Integrated Circuit chips, batteries, microprocessors, Light Emitting Diodes, Liquid Crystal Displays, polymer dome switches, and antennae), integrated in the bottom layer of the card structure, through use of injection molded thermosetting or thermoplastic material that becomes the core layer of said Advanced Smart Cards. A lamination finishing process can provide a high quality lower surface, and the encapsulation of the electronic components in the thermosetting or thermoplastic material provides protection from the lamination heat and pressure.

Abstract: An electronic card and a method for manufacturing the same wherein the electronic card is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board, wherein the circuit components positioned in a first portion of the electronic card are greater in height than the circuit components positioned in a second portion of the electronic card, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a core layer positioned between the top surface of the printed circuit board and the top overlay, wherein the first portion of the electronic card has a greater thickness than the second portion of the electronic card.

Abstract: An embedded electronic device and a method for manufacturing the same wherein the embedded electronic device is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board having a plurality of standoffs on the bottom surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a core layer positioned between the top surface of the printed circuit board and the top overlay.

Abstract: A smart card and a method for manufacturing the same wherein the smart card is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board, a filler board, attached to the top surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a thermosetting polymeric layer positioned between the top surface of the printed circuit board and the top overlay.

Abstract: A RFID bracelet and a method for manufacturing the same wherein the bracelet is composed of a bottom layer having a top surface and a bottom surface, a radio frequency identification microprocessor attached to the top surface of the bottom layer, an antenna, operably coupled to the radio frequency identification microprocessor and attached to the top surface of the bottom layer, a core layer, positioned above the bottom layer and attached to the bottom layer, the radio frequency identification microprocessor and the antenna and a top layer, positioned above the core layer and attached to the core layer.

Abstract: A smart card and a method for manufacturing the same wherein the smart card is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board, a filler board, attached to the top surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a thermosetting polymeric layer positioned between the top surface of the printed circuit board and the top overlay.

Abstract: Improved battery packaging and constructions for batteries, particularly thin, flat-profile packaged batteries are provided. The battery packaging constructions may eliminate the need for soldering by providing current collector tabs coated by electrically conductive adhesive tape such as z-axis conductive tape and may provide support for current collector tabs and a regular battery perimeter by providing supportive battery packaging and/or frame materials. Better fabrication results, particularly when the batteries are used in smart cards, RFID tags, and medical devices.

Abstract: Convenient, portable chargers for recharging a secondary battery in an electronically readable card which can be in sleeve form. The portable chargers are lightweight and portable and desirably have dimensions that are not much larger than those of an electronically readable card. The chargers may include a connector such as a sleeve for securing an electronically readable card, a power source for providing recharging power and a power interface for delivering the recharging power from the power source to the electronically readable card. The power source may take on a variety of forms including another battery, a photovoltaic array or a direct plug connection to a electric wall outlet, Universal Serial Bus port or a telephone jack. In some embodiments the portable chargers charge the battery in an electronically readable card by inductive coupling.

Abstract: A battery includes an anode, a cathode, and a polymer matrix electrolyte (PME) separator disposed between the anode and the cathode. The PME separator includes a polyimide, at least one lithium salt in a concentration of at least 0.5 moles of lithium per mole of imide ring provided by the polyimide, and at least one solvent intermixed. The PME is generally homogeneous as evidenced by its high level of optically clarity. The battery can be a lithium ion or lithium metal battery.

Abstract: An apparatus (110) for extracting impurities from a pulpous slurry. The apparatus has a housing (111) and an auxiliary chamber (113). The housing has a separation chamber (127) having stack of disks (159) spaced from each other so as to form channels (172) therebetween. The disks are mounted to a drive shaft (160) which is rotatably driven by a motor (161). The action of the rotating disks cause impurities to be projected to the outermost portion of the separation chamber while the desired pulpous fibers pass between through the channel to an accept tube (193) for collection.