Patents by Inventor Robert Skepnek

Robert Skepnek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Connectorized substrate and method of connectorizing a substrate
    Patent number: 6100596
    Abstract: A connectorized substrate and method of connectorizing a substrate is provided, including a substrate having conductive traces mounted thereon and solder paste connected to the conductive traces and conductive spheres mounted to the solder paste. The connectorized substrate of the present invention may be used to provide for components to be added to a motherboard such as a resistor network by mounting resistors to the conductive traces of the substrate such as thick-film ceramic resistors.
    Type: Grant
    Filed: March 19, 1996
    Date of Patent: August 8, 2000
    Assignee: Methode Electronics, Inc.
    Inventors: John J. Daly, Robert Skepnek