Abstract: The invention relates to a silver electrolyte for the deposition of silver layers on substrates, which comprises potassium silver cyanide, potassium cyanide with a content of at least 10 g/L, at least one grain refiner with a content of 0.2 to 10 g/L, at least one dispersant with a content of 1 to 10 g/L and at least one solid component with a content of 1 to 150 g/L, wherein the particles of the solid component have an average particle size (d50) of 10 nm-100 ?m. Furthermore, contact surfaces and methods for the deposition of such contact surfaces are shown.

Abstract: The invention relates to a silver electrolyte for the deposition of silver layers on substrates, which comprises potassium silver cyanide, potassium cyanide with a content of at least 10 g/L, at least one grain refiner with a content of 0.2 to 10 g/L, at least one dispersant with a content of 1 to 10 g/L and at least one solid component with a content of 1 to 150 g/L, wherein the particles of the solid component have an average particle size (d50) of 10 nm-100 ?m. Furthermore, contact surfaces and methods for the deposition of such contact surfaces are shown and the use of the electrolyte according to the invention in strip electroplating.

Abstract: The invention relates to a silver electrolyte for the deposition of silver layers on substrates, which comprises potassium silver cyanide, potassium cyanide with a content of at least 10 g/L, at least one grain refiner with a content of 0.2 to 10 g/L, at least one dispersant with a content of 1 to 10 g/L and at least one solid component with a content of 1 to 150 g/L, wherein the particles of the solid component have an average particle size (d50) of 10 nm-100 ?m. Furthermore, contact surfaces and methods for the deposition of such contact surfaces are shown.