Abstract: A method for forming a tileable detector array is presented.

Abstract: An ultrasound system is provided for imaging an object. The ultrasound system includes an ultrasound probe for acquiring ultrasound data and a cooling subsystem for actively removing heat from the ultrasound probe. The cooling subsystem includes a pump disposed within a reservoir containing a coolant and configured to circulate the coolant through the ultrasound probe via a conduit.

Abstract: A method for forming a tileable detector array is presented.

Abstract: According to embodiments of the present technique, a system and a method for addressing transducers in a two-dimensional transducer array is disclosed. According to one aspect of the present technique, the transducers are arranged in rows and columns, and the columns are coupled to a shared transmit and receive circuitry while the rows are coupled to a row selection circuitry. In another embodiment, each transducer is coupled to a separate, dedicated transmit circuitry and the columns are coupled to a shared receive circuitry.

Abstract: An ultrasonic imaging system wherein an exemplary system includes an array of transducer elements arranged along a first plane for transmitting first signals and receiving reflected signals for image processing. Circuit structures each have a major surface positioned in a co-planar orientation with respect to a major surface of another of the circuit structures to provide a sequence of the structures in a stack-like formation. Electrical connections are formed between adjacent circuit structures in the sequence. A connector region on each circuit structure includes a distal portion extending away from the major surface-with distal portions of connector regions of adjacent structures spaced apart from one another. A first wiring pattern extends from the major surface to the distal portion of the connector region.

Abstract: According to embodiments of the present technique, a system and a method for addressing transducers in a two-dimensional transducer array is disclosed. According to one aspect of the present technique, the transducers are arranged in rows and columns, and the columns are coupled to a shared transmit and receive circuitry while the rows are coupled to a row selection circuitry. In another embodiment, each transducer is coupled to a separate, dedicated transmit circuitry and the columns are coupled to a shared receive circuitry.

Abstract: A composite structure of a z-axis interconnect is presented. The composite structure includes a plurality of layers of backing material alternatingly arranged between a plurality of interconnect layers, where the plurality of interconnect layers is configured to facilitate coupling the composite structure of the z-axis interconnect to a transducer array, where the composite structure of z-axis interconnect is configured for use in an invasive probe.

Abstract: An ultrasonic imaging system (200). An exemplary system includes an array of transducer elements (50) arranged along a first plane (P1) for transmitting first signals and receiving reflected signals for image processing. Circuit structures (10, 20, 30, 40) each have a major surface (1a) positioned in a co-planar orientation with respect to a major surface of another of the circuit structures to provide a sequence of the structures (10, 20, 30, 40) in a stack-like formation. Electrical connections (34, 47) are formed between adjacent circuit structures in the sequence. A connector region (1b or 1b?) on each circuit structure includes a distal portion (1c or 1c?) extending away from the major surface (1a), with distal portions (1c, 1c?) of connector regions of adjacent structures spaced apart from one another. A first wiring pattern (41, 45, 46) extends from the major surface to the distal portion of the connector region.

Abstract: An ultrasound system is provided for imaging an object. The ultrasound system includes an ultrasound probe for acquiring ultrasound data and a cooling subsystem for actively removing heat from the ultrasound probe. The cooling subsystem includes a pump disposed within a reservoir containing a coolant and configured to circulate the coolant through the ultrasound probe via a conduit.

Abstract: An interconnect assembly is presented. The assembly includes an interconnect structure including a plurality of interconnect layers disposed in a spaced relationship, where each of the plurality of interconnect layers comprises a plurality of conductive traces disposed thereon. Furthermore, the assembly includes a redistribution layer disposed proximate the interconnect structure, where the redistribution layer is configured to facilitate coupling the interconnect structure to the one or more transducer elements on the transducer array.

Abstract: A high-density connection of multiple circuit boards having overlapping ends arranged in a stack. The metal traces on the stacked circuit boards are electrically connected by contact of the ends of the traces, which ends may be pads. The stacked circuit boards can be clamped, soldered or bonded together. Multiple circuit boards may be connected to a single circuit board. In one embodiment, double-sided circuit boards are stacked so that a first circuit board connects to a second circuit board through a third circuit board disposed intermediate the first and second circuit boards. The circuit boards may be flexible or rigid.

Abstract: An ultrasound system including an ultrasound probe, which has an ultrasonic transducer and a physical sensor adapted to sense engagement with a subject to be scanned by the ultrasonic transducer. The ultrasound system also includes a control system coupled to the ultrasound probe.

Abstract: A device comprising an array of sensors built on or in a substrate with a semiconducting surface and means for isolating each sensor element from its neighbors. In the case where the sensors are ultrasonic transducer elements, acoustic isolation is provided in the form of trenches between neighboring transducer elements to reduce acoustic crosstalk. The trenches may be filled with acoustically attenuative material. Electrical isolation in the form of semiconductive junctions is provided between neighboring transducer elements to reduce electrical crosstalk. In one example, back-to-back pn junction diodes are formed by ion implantation in zones located between neighboring transducer elements. These types of isolation can be employed alone or together.

Abstract: A combined acoustic backing and interconnect module for connecting an array of ultrasonic transducer elements to a multiplicity of conductors of a cable utilizes the backing layer volume to extend a high density of interconnections perpendicular to the transducer array surface. The module is made by injecting flowable backfill material into a mold made up of a plurality of spacer plates having aligned channels, with interleaved flexible circuit boards. The backfill material is cured to form a backing layer which supports the flexible circuit boards in mutually parallel relationship. Excess flexible circuit material on one side of the backing layer is cut flush with the front face of the backing layer, leaving exposed ends of the conductive traces on the flexible circuit boards. The module is then laminated to a piezoelectric ceramic layer, and diced. The flexible circuit board conductive traces are aligned with, and electrically connected to, signal electrodes of the transducer elements.

Abstract: For providing multiple-conductor circuit interconnections where there is a lack of precise dimensional control, as in manufacturing flexible printed circuits used to make high density electrical interconnections between ultrasonic transducer elements and the probe cable in a medical ultrasound probe, connection pads are formed in fanout arrays, with the longitudinal axes of individual pads extending along radial lines from the center of a circle. The fanout arrays are formed within generally trapezoidal areas, each having two parallel opposite sides extending along respective parallel chords to accommodate significant variation in dimensions of the respective substrates being connected. Multiple-row connection pad arrays may be provided, each with a plurality of fanout arrays of connection pads that may be parallel to each other and positioned at respectively different distances from the center of the circle, or may be arranged around, and positioned at equal distances from, the center of the circle.

Abstract: A method for fabricating "1.5D" and "2D" multilayer ultrasonic transducer arrays employs dicing saw kerfs, which provide acoustic isolation between rows. The kerfs are metallized to provide electrical connection between surface electrode layers and buried internal electrode layers. A multilayer piezoceramic transducer element for a "1.5D" or "2D" array produced by this method has higher capacitance, and accordingly provides better transducer sensitivity, in comparison to a single layer element.

Abstract: A method for fabricating "1.5D" and "2D" multilayer ultrasonic transducer arrays employs dicing saw kerfs, which provide acoustic isolation between rows. The kerfs are metallized to provide electrical connection between surface electrode layers and buried internal electrode layers. A multilayer piezoceramic transducer element for a "1.5D" or "2D" array produced by this method has higher capacitance, and accordingly provides better transducer sensitivity, in comparison to a single layer element.