Patents by Inventor Robert Sykes
Robert Sykes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250013564Abstract: Various implementations described herein relate to systems and methods for placing data on a Solid State Drive (SSD), including writing data to a non-volatile memory storage of the SSD, determining one or more of read errors, a number of invalid pages per block, or a read disturb counter for the data, determining access frequency of the data based on the one or more of the read errors, the number of invalid pages per block, or the read disturb counter, and partitioning the non-volatile memory storage into a plurality of regions based on the access frequency.Type: ApplicationFiled: September 23, 2024Publication date: January 9, 2025Applicant: Kioxia CorporationInventors: Robert Sykes, Gary James Calder
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Patent number: 12099440Abstract: Various implementations described herein relate to systems and methods for placing data on a Solid State Drive (SSD), including writing data to a non-volatile memory storage of the SSD, determining one or more of read errors, a number of invalid pages per block, or a read disturb counter for the data, determining access frequency of the data based on the one or more of the read errors, the number of invalid pages per block, or the read disturb counter, and partitioning the non-volatile memory storage into a plurality of regions based on the access frequency.Type: GrantFiled: December 31, 2019Date of Patent: September 24, 2024Assignee: KIOXIA CORPORATIONInventors: Robert Sykes, Gary Calder
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Patent number: 12059855Abstract: A method of forming a net shape preform for a high performance ballistic helmet includes preparing one or more full prepreg plies, preparing one or more filler prepreg plies, wherein a shape and orientation of one filler prepreg ply of the one or more filler prepreg plies is different from a shape and orientation of another filler prepreg ply of the one or more filler prepreg plies, layering the one or more full prepreg plies with one or more filler prepreg plies to form a ply stack and deforming a portion of the ply stack while constraining the ply stack by applying in-plane tensional force to the ply stack to form the net-shape preform.Type: GrantFiled: September 23, 2020Date of Patent: August 13, 2024Assignee: The United States of America as Represented by the Secretary of the ArmyInventors: Jason Parker, Tony Kayhart, Damian Kubiak, Robert Sykes
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Patent number: 11357686Abstract: A collapsible containment apparatus (36) with a first hub (21), a second hub (22), a plurality of articulated arms (23, 25) coupled to the first hub (21), a plurality of support arms (24) coupled to both the second hub (22) and the articulated arms (23), and a flexible canopy (73) carried by the articulated arms (23). The apparatus (36) is collapsed by relative movement of the two hubs (21, 22) away from one another, and deployed by relative movement of the hubs (21, 22) toward one another. When the apparatus (36) is deployed the canopy (73) creates a closed interior environment, which may be sterile.Type: GrantFiled: February 11, 2019Date of Patent: June 14, 2022Assignee: BREEGI SCIENTIFIC, INC.Inventors: Wisam K. Breegi, Robert Sykes
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Patent number: 10265740Abstract: A method of cleaning solder from the jaws of a solder ball test device including the steps of heating a gas to a temperature above the melting temperature of the solder and directing the heated has over the jaws of a solder ball test device to remove solder from the jaws, and an apparatus for carrying out the method.Type: GrantFiled: July 17, 2015Date of Patent: April 23, 2019Assignee: XYZTEC BVInventor: Robert Sykes
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Publication number: 20170209903Abstract: A method of cleaning solder from the jaws of a solder ball test device including the steps of heating a gas to a temperature above the melting temperature of the solder and directing the heated has over the jaws of a solder ball test device to remove solder from the jaws, and an apparatus for carrying out the method.Type: ApplicationFiled: July 17, 2015Publication date: July 27, 2017Inventor: Robert Sykes
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Patent number: 7244737Abstract: The present invention relates to a compound of the general formula: wherein R1 is a 4-pyrimidinyl ring substituted at the 6-position by halo, hydroxy, 2-cyanophenoxy, 2,6-difluorophenoxy, 2-nitrophenoxy or 2-thiocarboxamidophenoxy and wherein R2 is any group which can be transesterified to form a methyl ester. The present invention is also directed to a process of preparing said compound.Type: GrantFiled: June 20, 2006Date of Patent: July 17, 2007Assignee: Syngenta LimitedInventors: David Anthony Jackson, James Peter Muxworthy, Mark Robert Sykes
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Publication number: 20070042335Abstract: A system and method for collecting responses to assessment or survey items utilizes an input device to store individual responses to items of an assessment or a survey. The input device transmits the individual responses to a receiving unit for storage and analysis. The responses can be transmitted immediately upon completion of an assessment or survey item, at predetermined times during the collection of responses, after a predetermined period of user inactivity or upon completion of a predetermined group of assessment or survey items. The input device can also store a collection file containing all the responses and transmit the collection file after completion of the assessment or survey. The system and method can also utilize a locating device to determine an initial location of an input device and to monitor the current location of the input device during completion of the assessment or survey to detect and deter cheating.Type: ApplicationFiled: May 11, 2006Publication date: February 22, 2007Applicant: CTB McGraw-HillInventors: Sylvia Tidwell-Scheuring, Robert Sykes, Theresa Sage, G. Winner, Tony Flores, Karen Burkhart, Maureen Grazioli, Mostafa Mehrabani
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Patent number: 7084272Abstract: A process for the preparation of a compound of the general formula (I): wherein R1 is a 4-pyrimidinyl ring substituted at the 6-position by halo, hydroxy, 2-cyanophenoxy, 2,6-difluorophenoxy, 2-nitrophenoxy or 2-thiocarboxamidophenoxy and R2 is any group which can be transesterified to form a methyl ester, which comprises treating a compound of general formula (II): wherein R1 and R2 have the meanings given above, with a formylating agent and subsequently treating the formylated product with a methylating agentType: GrantFiled: May 3, 2002Date of Patent: August 1, 2006Assignee: Syngenta LimitedInventors: David Anthony Jackson, James Peter Muxworthy, Mark Robert Sykes
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Publication number: 20040242607Abstract: A process for the preparation of a compound of the general formula (I): wherein R1 is a 4-pyrimidinyl ring substituted at the 6-position by halo, hydroxy, 2-cyanophenoxy, 2,6-difluorophenoxy, 2-nitrophenoxy or 2-thiocarboxamidophenoxy and R2 is any group which can be transesterified to form a methyl ester, which comprises treating a compound of general formula (II): wherein R1 and R2 have the meanings given above, with a formylating agent and subsequently treating the formylated product with a methylating agent.Type: ApplicationFiled: June 9, 2004Publication date: December 2, 2004Inventors: David Anthony Jackson, James Peter Muxworthy, Mark Robert Sykes
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Patent number: 6341530Abstract: A device is described for testing the force to shear a deposit of solder or gold from a substrate, these deposits having a diameter in the range 50-100 &mgr;m and being for the bonding of electrical conductors. A shear tool has a semi-cylindrical cavity which closely approximates to the mean diameter of a range of substrates. This tool is adapted to re-shape substrates for a better fit, re-shaping occurring over 30% or less of the circumference of a deposit, and to a depth of 10% or less of the diameter of the substrate.Type: GrantFiled: May 3, 2000Date of Patent: January 29, 2002Assignee: D{dot over (a)}ge Precision Industries, Ltd.Inventor: Robert Sykes
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Patent number: 6301971Abstract: Apparatus for testing electrical wire bonds of semiconductor devices includes two unequal length cantilever arms (14a, 14b) on a baseplate (11) and a test head (15) at the free end of the arms. The arrangement ensures substantially frictionless straight line movement of a test hook (32) on the text head over the range of deflection expected. A pneumatic or magnetic (21, 22) frictionaless damper is disclosed. The test hook (32) may be orientated by a stepper motor (35) of the test head.Type: GrantFiled: November 20, 1998Date of Patent: October 16, 2001Assignee: Dage Precision Industries, Inc.Inventor: Robert Sykes
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Patent number: 6237422Abstract: A test device for applying a tensile force to electrical bond sites of a semiconductor device includes jaws (21), adapted to closely engage the surface of the bond site, typically a solder ball (22), while an inner edge portion (23) of each jaw approaches the jaw axis. By closely confining the bond site, the clamping forces exerted can be increased without risk that the bond site will be crushed. In a preferred embodiment the jaws permit slight reshaping of the bond site to increase the area of engagement therewith.Type: GrantFiled: December 9, 1998Date of Patent: May 29, 2001Assignee: Dage Precision Industries Ltd.Inventor: Robert Sykes
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Patent number: 6178823Abstract: An apparatus and method for testing angled strand connections in a miniature electrical device includes a test tool movable simultaneously along two mutually perpendicular axes and perpendicular to the strand direction. The tool measures breaking force along one axis only, the breaking force in the direction of tool movement being calculated by reference to the angle of tool movement. The method gives rapid testing of successive strands with good operator view.Type: GrantFiled: May 28, 1999Date of Patent: January 30, 2001Assignee: Dage Precision Industries, Ltd.Inventor: Robert Sykes
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Patent number: 6078387Abstract: Apparatus for testing electrical bonds of a semiconductor device includes a cantilever arm (14a) with a test head (16) mounted thereon. The test head (16) is biased by the arm (14a) against a base plate (11), but can be moved away from the base plate (11) by an air bearing (22) to ensure substantially frictionless initial positioning. Sensing means (32;34) for sensing contact with a semiconductor substrate are also disclosed.Type: GrantFiled: November 20, 1998Date of Patent: June 20, 2000Assignee: Dage Precision Industries, Ltd.Inventor: Robert Sykes
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Patent number: 5036871Abstract: A flexible lance and drive system (10) extends through manhole (12) into blow down lane (14) of a pressurized water reactor (PWR) steam generator secondary side assembly (16). The system (10) includes a support rail (18) passing through the manhole (12) and along the blow down lane (14). A transporter (20) is suspended for locomotion along the support rail (18). A flexible lance (24) extends through the transporter (20) and can be driven by the transporter into tube bundle (26) to a greater or lesser extent as required to observe and/or clean sludge deposits (28) within the tube bundle (26). High pressure hoses (34), nitrogen purge line (36) and Fiber optics cable (32) is supported by a spacerless hosebar structure (38). The hosebar structure (38) is integrally formed from a flexible plastic material in a single piece.Type: GrantFiled: February 22, 1989Date of Patent: August 6, 1991Assignee: Electric Power Research Institute, Inc.Inventors: Steven K. Ruggieri, Stephen Jens, Robert Sykes