Patents by Inventor Robert T. Jenkins

Robert T. Jenkins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4005455
    Abstract: An interconnect pad for electrical coupling between a semiconductor integrated circuit and external leads or the like which includes a secondary conductive path in the event of degradation of the interconnect pad. Metallic contact and conductive elements in the integrated circuit are separated from, and otherwise protected from, deliquescent chemical radicals such as P.sub.2 O.sub.5 contained in underlying structure of the integrated circuit by a layer of silicon.
    Type: Grant
    Filed: August 21, 1974
    Date of Patent: January 25, 1977
    Assignee: Intel Corporation
    Inventors: Willis George Watrous, Jr., Robert T. Jenkins