Abstract: The invention features a method of fabricating a printed circuit board with low dielectric materials using a modular technique. Sub-assemblies are first constructed, tested, and then subsequently incorporated into the final circuit board assembly which has a triplate geometry. Dielectric materials are chosen which enhance the performance of the circuit board.

Abstract: A method of making a printed circuit board is disclosed wherein metallic seed particles are applied to a surface of the substrate. An image of the desired conductor pattern is defined by a maskant layer to permit the subsequent electroless deposition of the conductor material upon the exposed seeded areas of the substrate. Then, the substrate surface is subjected to a plasma discharge to facilitate removal of the seed particles.

Abstract: A method and apparatus are disclosed for feeding and securing a fabric tape enclosing a wire to a sheet of fabric, such as a mattress pad, along a predetermined circuitous path. The pad is supported in a generally planar configuration and is movable through a plane under the needle of a sewing head so that the needle traverses the circuitous path on the pad. The tape and enclosed wire are supplied to a guide rotatably mounted on the sewing head for guiding the tape and enclosed wire onto the pad towards the needle from locations circumferentially disposed about a vertical axis of the needle. Provision is made for moving the guide about the sewing head as the pad moves in the circuitous path under the needle so that the tape and enclosed wire move towards the needle generally along the circuitous path.

Abstract: An apparatus is disclosed for transferring a sheet of deformable material such as cloth on a first conveyer to a second conveyer at a right angle to the first conveyor. The apparatus includes a full-length clamp having an elongated support surface for grasping and supporting the sheet along a side edge adjacent to the second conveyor and aligned with the direction of movement of first conveyor. The clamp is supported on a carriage which is movable in the direction of movement of the second conveyer and means are provided to move the carriage between a clamping location where the clamp grasps the sheet and a release location spaced from the first conveyor.

Abstract: A process for stabilizing printed circuit board substrate or laminate through application of a number of laminate conditioning and baking cycles which function to provide the laminates with dimensional stability. This enables greater control and more precise drilling of the laminates in subsequent fabrication and assembly operations. The dimensional stability for a substrate becomes more critical as the substrate size is increased.