Patents by Inventor Robert T. Young

Robert T. Young has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF ELECTROPLATING A PLURALITY OF CONDUCTIVE FINGERS
    Publication number: 20080149368
    Abstract: A method of electroplating may include placing a pair of conductive fingers in proximity to an edge of a circuit board, where the pair are coupled to be electrically isolated, and where the pair are substantially longitudinally oriented away from the edge. A trace electrically couples the pair of conductive fingers via a shortest path between the pair of conductive fingers. A plating bar is electrically coupled to one of the pair of conductive fingers and thereafter electroplating the pair of conductive fingers via the plating bar. Subsequent to electroplating, laser drilling the trace to electrically isolate the pair of conductive fingers.
    Type: Application
    Filed: March 12, 2008
    Publication date: June 26, 2008
    Applicant: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
    Inventor: Robert T. Young
  • Method of electroplating a plurality of conductive fingers
    Patent number: 7350294
    Abstract: A method of electroplating may include placing a pair of conductive fingers in proximity to an edge of a circuit board, where the pair are coupled to be electrically isolated, and where the pair are substantially longitudinally oriented away from the edge. A trace electrically couples the pair of conductive fingers via a shortest path between the pair of conductive fingers. A plating bar is electrically coupled to one of the pair of conductive fingers and thereafter electroplating the pair of conductive fingers via the plating bar. Subsequent to electroplating, laser drilling the trace to electrically isolate the pair of conductive fingers.
    Type: Grant
    Filed: February 27, 2006
    Date of Patent: April 1, 2008
    Assignee: Emerson Network Power - Embedded Computing, Inc.
    Inventor: Robert T. Young
  • Circuit board having an overlapping via
    Patent number: 7064279
    Abstract: A printed circuit board (100) includes a first BGA landing pad (102) having a first clearance zone (106) and a second BGA landing pad (104) having a second clearance zone (108). A via (110), overlaps the first clearance zone and the second clearance zone such that the first BGA landing pad and the second BGA landing pad are electrically coupled to the via.
    Type: Grant
    Filed: September 23, 2004
    Date of Patent: June 20, 2006
    Assignee: Motorola, Inc.
    Inventors: Matthew C. Meyer, Jesse C. Chai, Paul H. Roosen, Robert T. Young
  • Ceramic tile shear testing apparatus and method
    Patent number: 4823611
    Abstract: A ceramic tile shear testing apparatus and method of use. The apparatus includes a frame with a hydraulic cylinder for moving a shearing member extending outwardly of the frame. The apparatus may be placed on a bonding layer on a working surface adjacent a tile to be tested and the hydraulic cylinder actuated to apply a force to the tile in a direction parallel to the working surface sufficient to break the bond holding the tile to the surface. Pressure in the hydraulic cylinder may be measured when the shear occurs as a correlation of the shear strength of the bond.
    Type: Grant
    Filed: November 18, 1987
    Date of Patent: April 25, 1989
    Inventor: Robert T. Young