Abstract: A beam delivery system is provided that includes a beam delivery photonic integrated circuit. The beam delivery photonic integrated circuit includes one or more optical inputs; a plurality of waveguide outputs; and a plurality of beam paths. Each beam path connects one of the plurality of waveguide outputs to at least one of the optical inputs. The plurality of waveguide outputs are configured to emit a plurality of parallel beams. The beam delivery photonic integrated circuit is on a chip. The beam delivery system further includes a telecentric optical relay assembly. The telecentric optical relay assembly is configured to receive the plurality of parallel beams provided by the waveguide outputs and focus each received beam on a corresponding one of a plurality of positions of an atomic object confinement apparatus in a telecentric manner.

Abstract: A method of electroplating may include placing a pair of conductive fingers in proximity to an edge of a circuit board, where the pair are coupled to be electrically isolated, and where the pair are substantially longitudinally oriented away from the edge. A trace electrically couples the pair of conductive fingers via a shortest path between the pair of conductive fingers. A plating bar is electrically coupled to one of the pair of conductive fingers and thereafter electroplating the pair of conductive fingers via the plating bar. Subsequent to electroplating, laser drilling the trace to electrically isolate the pair of conductive fingers.

Abstract: A method of electroplating may include placing a pair of conductive fingers in proximity to an edge of a circuit board, where the pair are coupled to be electrically isolated, and where the pair are substantially longitudinally oriented away from the edge. A trace electrically couples the pair of conductive fingers via a shortest path between the pair of conductive fingers. A plating bar is electrically coupled to one of the pair of conductive fingers and thereafter electroplating the pair of conductive fingers via the plating bar. Subsequent to electroplating, laser drilling the trace to electrically isolate the pair of conductive fingers.

Abstract: A printed circuit board (100) includes a first BGA landing pad (102) having a first clearance zone (106) and a second BGA landing pad (104) having a second clearance zone (108). A via (110), overlaps the first clearance zone and the second clearance zone such that the first BGA landing pad and the second BGA landing pad are electrically coupled to the via.

Abstract: A ceramic tile shear testing apparatus and method of use. The apparatus includes a frame with a hydraulic cylinder for moving a shearing member extending outwardly of the frame. The apparatus may be placed on a bonding layer on a working surface adjacent a tile to be tested and the hydraulic cylinder actuated to apply a force to the tile in a direction parallel to the working surface sufficient to break the bond holding the tile to the surface. Pressure in the hydraulic cylinder may be measured when the shear occurs as a correlation of the shear strength of the bond.