Abstract: The present invention combines automatic process control feedback or process improvement recommendations based on capturing consumable data, running the consumable data through a data analytics processing system and establishing logical process improvement recommendations and actions based on consumable consumption ratios and process inefficiency correlations.

Abstract: Testsite system for use in an integrated circuit handler, the testsite system for testing plastic leaded chip carriers (PLCC), leadless chip carriers (LCC) and other IC packages. The testsite system utilizes a pocket in a socket which is movable in frame between an insert position for the IC and a test position for the IC. The testsite includes an ejector which operates against a first spring constant and a movable pocket assembly which operates against a second spring constant. The movable pocket in the socket provides for alignment between the IC package, and the contact wires insure positive electrical integrity. The spring action provides for ejection of an IC after test from the pocket by a spring actuated ejector, as well as the socket assembly returning to a home position while carrying the ejector and IC at the same time through the second spring action. Alternate embodiments include a testsite with air chambers within and adjacent to the testsite for a controlled testsite temperature environment.

Abstract: Testsite system for use in an integrated circuit handler, the testsite system for testing plastic leaded chip carriers (PLCC), leadless chip carriers (LCC) and other IC packages. The testsite system utilizes a pocket in a socket which is moveable in a frame between a insert position for the IC and a test position for the IC. The testsite includes an ejector which operates against a first spring constant and a moveable pocket assembly which operates against a second spring constant. The moveable pocket in the socket provides for alignment between the IC package and the contact wires insuring positive electrical integrity. The spring action provides for ejection of an IC after test from the pocket by a spring actuated ejector, as well as the socket assembly returning to a home position while carrying the ejector and IC at the same time through the second spring action.