Abstract: A chip slapper including a substrate, a sticking layer on the substrate, a conductive layer on the sticking layer in the shape of two lands separated by a bridge portion between the two lands, a buffer material on the conductive layer, a protective coating on the buffer layer extending across at least a substantial portion of the two lands but absent from the bridge portion, and a flyer layer over the bridge portion. The buffer layer prevents migration of the material of the coating into the material of the conductive layer and vice versa and better adheres the flyer layer on the bridge portion where the coating is absent.

Abstract: The invention provides a plate handling system for use in an imaging system in which plates of recording media are fed through an imaging unit. The plate handling system includes an input portion for receiving a plate from the imaging engine, a first conveying assembly, a second conveying assembly, an intermediate portion and an output portion. The first conveying assembly extends from the input portion to the intermediate portion, and is provided to direct a plate along a first direction. The second conveying assembly extends toward the output portion of the plate handling system, and is provided to direct a plate along a second direction from the intermediate portion to the output portion. The second direction is generally perpendicular to the first direction.