Abstract: An integrated circuit load board includes a substrate on which a plurality of integrated circuit sockets and an integrated test circuit are mounted. The integrated test circuit generates test signals that are applied to the integrated circuit sockets. The integrated test circuit also receives response signals from the integrated circuit sockets indicative of the manner in which integrated circuits in the sockets responded to the test signals. Several of the load boards may be placed on a test head that may be coupled to a host. The integrated test circuit may also be used with an integrated circuit probe card, where the test signals are applied to an integrated circuit coupled to the probe card.

Abstract: A testing method and system is used to test memory modules each of which has a memory hub coupled to a plurality of memory devices. The testing system and method includes a test interface circuit having a memory interface that is coupled to transmit and receive memory signals to and from a tester through a memory bus. The test interface circuit couples test signals to the memory hub in the memory module through a communications link responsive to command, address and data signals received from the tester. The test interface circuit also receives signals from the memory hub in the memory module through the communications link that are indicative of the response of the memory module to the test signals. The test interface circuit then provides corresponding results data to the tester.

Abstract: An integrated circuit load board includes a substrate on which a plurality of integrated circuit sockets and an integrated test circuit are mounted. The integrated test circuit generates test signals that are applied to the integrated circuit sockets. The integrated test circuit also receives response signals from the integrated circuit sockets indicative of the manner in which integrated circuits in the sockets responded to the test signals. Several of the load boards may be placed on a test head that may be coupled to a host.

Abstract: An integrated circuit load board includes a substrate on which a plurality of integrated circuit sockets and an integrated test circuit are mounted. The integrated test circuit generates test signals that are applied to the integrated circuit sockets. The integrated test circuit also receives response signals from the integrated circuit sockets indicative of the manner in which integrated circuits in the sockets responded to the test signals. Several of the load boards may be placed on a test head that may be coupled to a host.

Abstract: A testing method and system is used to test memory modules each of which has a memory hub coupled to a plurality of memory devices. The testing system and method includes a test interface circuit having a memory interface that is coupled to transmit and receive memory signals to and from a tester through a memory bus. The test interface circuit couples test signals to the memory hub in the memory module through a communications link responsive to command, address and data signals received from the tester. The test interface circuit also receives signals from the memory hub in the memory module through the communications link that are indicative of the response of the memory module to the test signals. The test interface circuit then provides corresponding results data to the tester.

Abstract: An integrated circuit load board includes a substrate on which a plurality of integrated circuit sockets and an integrated test circuit are mounted. The integrated test circuit generates test signals that are applied to the integrated circuit sockets. The integrated test circuit also receives response signals from the integrated circuit sockets indicative of the manner in which integrated circuits in the sockets responded to the test signals. Several of the load boards may be placed on a test head that may be coupled to a host.

Abstract: A wafer cassette includes a stationary dual-zone temperature control base and a removable wafer cassette top. The top includes a main cassette support structure, onto which wafer test electronics, a test interface connector, a wafer interconnect assembly, a wafer test area, a flex film interconnect, and a wafer chuck with evacuation chamber and electric wafer heater, and at least one rough alignment fixture are mounted. A wafer to be tested is inserted, with a pressure-isolating seal, between the wafer chuck and the wafer test area. The base is a stationary fixed portion which includes a first support compartment, a second support compartment and thermal circuits, each of which includes fluid inlet and outlet connections. The fixed portion further includes a heater interconnect to provide connection and external access for a heater element, as well as a vacuum interconnect line to provide external connection to the evacuation chamber.