Abstract: A fixture clamps a plurality of lids onto a multi-chip module (MCM) integrated circuit for adhesively attaching the lids to cover a plurality of cavities in the module in which chips or dies are mounted. The fixture includes a base plate which is formed with recesses in which the lids and the module are fittingly retained with the lids properly positioned relative to the module. A pressure plate is guided onto the module by a pin assembly and presses the module against the base plate. A plurality of spring loaded clamps have first jaws that engage with the lids through respective holes in the base plate and second jaws that engage with the pressure plate. The clamp thereby clamps the lids and the pressure plate to the module. The assembly including the module, lids, pressure plate and clamps is then removed from the base plate to enable curing of an adhesive that bonds the lids to the module, and frees the base plate for reuse.