Abstract: A method of making a radiation sensor wherein a plurality of thermopiles are formed on one wafer and a plurality of packages for the thermopiles are formed in another wafer. Each package includes a formed well covered by a window. The two wafers are bonded in a controlled gas or vacuum environment such that each thermopile resides in the well below the window of a package.

Abstract: Methods and systems for detecting a proximity of an object are provided. The method includes receiving a first beam of radiation from a first field of view directed onto a first detector and a second beam of radiation from a second field of view directed onto a second detector wherein the second beam is angularly displaced from the first beam by a predetermined amount, generating a first output signal from the first detector correlative to the energy received from the first beam and a second output signal from the second detector correlative to the energy received from the second beam, and outputting a proximity signal indicative of the proximity of an object when a differential between the first and second output signals exceeds a predetermined threshold.