Abstract: A method of manufacturing an impeller for a thermal management device includes partially curing a curable liquid in a curable liquid bath to form a first stage rotor, removing the first stage rotor from the curable liquid bath, the first stage rotor having excess curable liquid on a surface thereof, rotating the first stage rotor to displace the excess curable liquid radially outward from a rotational axis to compensate for imbalances in the first stage rotor, and fully curing the first stage rotor and at least a portion of the excess curable liquid to produce a second stage rotor that is more rotationally balanced than the first stage rotor.

Abstract: A thermal management device with electromagnetic (EM) shielding includes a fin pack with a plurality of channels. The fin pack has an upper and lower surface. The fin pack has a pack length, pack height, and pack width. The fin pack has fins are oriented connecting the upper surface to the lower surface. The plurality of channels extends from a first end toward a second end. A first channel of the plurality of channels is adjacent the upper surface, and a second channel of the plurality of channels is adjacent the lower surface.

Abstract: Systems and methods are described, and one method includes storing a PCB dimension, a vapor chamber (VC) case configuration, a package height of a heat-generating (HG) device, a component data identifying a height of a component, and a layout configuration data indicating locations for the HG device and the component. Upon determining the component location is an interfering location, the VC case configuration data is updated to indicate an inner clearance perimeter for the VC case, surrounding the interfering location. Electroforming forms the VC, for thermal coupling to the HG device, having a VC case with rimless, seamless outer peripheral surfaces aligned and facing according to the VC case outer perimeter, and other rimless surfaces aligned and facing, relative to the clearance perimeter, to form a clearance.