Patents by Inventor Robert Ullman MYERS

Robert Ullman MYERS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11726529
    Abstract: A thermal management device with electromagnetic (EM) shielding includes a fin pack with a plurality of channels. The fin pack has an upper and lower surface. The fin pack has a pack length, pack height, and pack width. The fin pack has fins are oriented connecting the upper surface to the lower surface. The plurality of channels extends from a first end toward a second end. A first channel of the plurality of channels is adjacent the upper surface, and a second channel of the plurality of channels is adjacent the lower surface.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: August 15, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Bo Dan, Robert Ullman Myers, Aaron Ray Paff, Raghavendra S Kanivihalli, Eugene Lee
  • Patent number: 11712838
    Abstract: A method of manufacturing an impeller for a thermal management device includes partially curing a curable liquid in a curable liquid bath to form a first stage rotor, removing the first stage rotor from the curable liquid bath, the first stage rotor having excess curable liquid on a surface thereof, rotating the first stage rotor to displace the excess curable liquid radially outward from a rotational axis to compensate for imbalances in the first stage rotor, and fully curing the first stage rotor and at least a portion of the excess curable liquid to produce a second stage rotor that is more rotationally balanced than the first stage rotor.
    Type: Grant
    Filed: May 4, 2020
    Date of Patent: August 1, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Lincoln Matthew Ghioni, Robert Ullman Myers, Bo Dan, Andrew Douglas Delano
  • Publication number: 20220035415
    Abstract: A thermal management device with electromagnetic (EM) shielding includes a fin pack with a plurality of channels. The fin pack has an upper and lower surface. The fin pack has a pack length, pack height, and pack width. The fin pack has fins are oriented connecting the upper surface to the lower surface. The plurality of channels extends from a first end toward a second end. A first channel of the plurality of channels is adjacent the upper surface, and a second channel of the plurality of channels is adjacent the lower surface.
    Type: Application
    Filed: October 18, 2021
    Publication date: February 3, 2022
    Inventors: Bo Dan, Robert Ullman Myers, Aaron Ray Paff, Raghavendra S Kanivihalli, Eugene Lee
  • Patent number: 11150700
    Abstract: A thermal management device with electromagnetic (EM) shielding includes a fin pack with a plurality of channels. The fin pack has an upper and lower surface. The fin pack has a pack length, pack height, and pack width. The fin pack has fins are oriented connecting the upper surface to the lower surface. The plurality of channels extends from a first end toward a second end. A first channel of the plurality of channels is adjacent the upper surface, and a second channel of the plurality of channels is adjacent the lower surface.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: October 19, 2021
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Bo Dan, Robert Ullman Myers, Aaron Ray Paff, Raghavendra S Kanivihalli, Eugene Lee
  • Publication number: 20210001539
    Abstract: A method of manufacturing an impeller for a thermal management device includes partially curing a curable liquid in a curable liquid bath to form a first stage rotor, removing the first stage rotor from the curable liquid bath, the first stage rotor having excess curable liquid on a surface thereof, rotating the first stage rotor to displace the excess curable liquid radially outward from a rotational axis to compensate for imbalances in the first stage rotor, and fully curing the first stage rotor and at least a portion of the excess curable liquid to produce a second stage rotor that is more rotationally balanced than the first stage rotor.
    Type: Application
    Filed: May 4, 2020
    Publication date: January 7, 2021
    Inventors: Lincoln Matthew GHIONI, Robert Ullman MYERS, Bo DAN, Andrew Douglas DELANO
  • Patent number: 10732681
    Abstract: Thermal management devices and systems, and corresponding methods of cooling computing devices are described herein. Such devices, systems, and methods may be advantageous in providing optimal thermal management for the computing device and/or minimizing acoustics in the computing device for a plurality of rotational fan speeds. Additionally, optimal thermal management may provide an increase in system performance and an increase in computing device life expectancy. In one example, a thermal management system includes a fan configured to move air through an outlet opening of the fan and at least one airflow guide positioned adjacent to the outlet opening. The at least one airflow guide is configured to direct movement of the air from the outlet opening to dissipate heat within an electronic device, and the at least one airflow guide is configured to pivot about an axis to move between a first position to a second position based on a change in a rotational speed of the fan.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: August 4, 2020
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Bo Dan, Robert Ullman Myers, James Hao-An Chen Lin, Andrew William Hill, Han Li
  • Publication number: 20200142450
    Abstract: A thermal management device with electromagnetic (EM) shielding includes a fin pack with a plurality of channels. The fin pack has an upper and lower surface. The fin pack has a pack length, pack height, and pack width. The fin pack has fins are oriented connecting the upper surface to the lower surface. The plurality of channels extends from a first end toward a second end. A first channel of the plurality of channels is adjacent the upper surface, and a second channel of the plurality of channels is adjacent the lower surface.
    Type: Application
    Filed: November 2, 2018
    Publication date: May 7, 2020
    Inventors: Bo DAN, Robert Ullman MYERS, Aaron Ray PAFF, Raghavendra S KANIVIHALLI, Eugene LEE
  • Publication number: 20200033919
    Abstract: Thermal management devices and systems, and corresponding methods of cooling computing devices are described herein. Such devices, systems, and methods may be advantageous in providing optimal thermal management for the computing device and/or minimizing acoustics in the computing device for a plurality of rotational fan speeds. Additionally, optimal thermal management may provide an increase in system performance and an increase in computing device life expectancy. In one example, a thermal management system includes a fan configured to move air through an outlet opening of the fan and at least one airflow guide positioned adjacent to the outlet opening. The at least one airflow guide is configured to direct movement of the air from the outlet opening to dissipate heat within an electronic device, and the at least one airflow guide is configured to pivot about an axis to move between a first position to a second position based on a change in a rotational speed of the fan.
    Type: Application
    Filed: July 26, 2018
    Publication date: January 30, 2020
    Inventors: Bo Dan, Robert Ullman Myers, James Hao-An Chen Lin, Andrew William Hill, Han Li
  • Publication number: 20200024763
    Abstract: Systems and methods are described, and one method includes storing a PCB dimension, a vapor chamber (VC) case configuration, a package height of a heat-generating (HG) device, a component data identifying a height of a component, and a layout configuration data indicating locations for the HG device and the component. Upon determining the component location is an interfering location, the VC case configuration data is updated to indicate an inner clearance perimeter for the VC case, surrounding the interfering location. Electroforming forms the VC, for thermal coupling to the HG device, having a VC case with rimless, seamless outer peripheral surfaces aligned and facing according to the VC case outer perimeter, and other rimless surfaces aligned and facing, relative to the clearance perimeter, to form a clearance.
    Type: Application
    Filed: July 23, 2018
    Publication date: January 23, 2020
    Applicant: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Bo DAN, Robert Ullman MYERS, Han LI, James Hao-An Chen LIN, Andrew HILL