Abstract: An electrical device. The electrical device includes a first substrate, a second substrate facing the first substrate, a unpackaged semiconductor die electrically and thermally connected to the first substrate, a first lead electrically connected between the unpackaged semiconductor die and the second substrate, and a second lead electrically connected between the first and second substrates.

Abstract: A display frame [10] for displaying photographs and other sheet-like articles comprises an outer shell [11], a liner [20] and a threaded cap [33]. The outer shell is transparent, generally cup-shaped and has a tapered inner wall [15]. The liner has a tapered outer surface [23] upon which are positioned a series of ribs [26], with the taper of the outer surface of the liner closely matched to that of the inner wall of the outer shell. Photographs or photocopies may be secured to one another and trimmed into an arcuate array [30]and the array placed within the outer shell. As the liner is inserted into the outer shell, the ribs contact the array and act as "skis" to allow the liner to be moved relative to the array without tearing, crumpling or otherwise marking the array.

Abstract: The present device includes a resistor network wherein the values of the resistors are chosen such that the heat generated by current passing through the resistors will be substantially equal to heat generated at a semiconductor junction which is to be cooled. The present device further includes a heat sink which is substantially identical to the heat sink employed to withdraw heat from the semiconductor junction to be cooled. Accordingly, the present device provides heat which is identical to the heat generated at the semiconductor junction and which heat remains ambient to the semiconductor junction to be cooled. The present device further includes a sensor which converts temperature to an electrical signal and which is located substantially in the center of the resistor network and at a distance from the heat sink that approximates the position of the semiconductor junction from its heat sink.