Abstract: A circuit board assembly comprising a surface-mounted microelectronic device combination, including a metallic base member having an insulating layer thereon, and a plurality of electrically conductive mounting pads patterned on the insulating layer. At least one pair of hermetically sealed diodes is bonded to the pads, such that each diode of each pair has one terminal bonded to a first pad, and the other terminal bonded to second and third pads, respectively. For example, a two-diode combination is provided with three leads, one for each pad, whereby various lead connections may be selected, for the purpose of using each diode separately; or for the purpose of using both diodes, either in series or in parallel.