Patents by Inventor Robert Venuti

Robert Venuti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMMUNICATION MODULE ALIGNMENT
    Publication number: 20180330859
    Abstract: Systems, and apparatus for aligning structures are provided. One of the apparatus includes a first communication module including: a printed circuit board, one or more integrated circuit packages mounted on the printed circuit board, and one or more magnets positioned relative to the one or more integrated circuit packages, wherein the one or more magnets are configured to attractively couple the first communication module to a second communication module positioned in proximity to the first communication module.
    Type: Application
    Filed: July 23, 2018
    Publication date: November 15, 2018
    Inventors: Stephen Robert Venuti, Steve Novak
  • Communication module alignment
    Patent number: 10049801
    Abstract: Systems, and apparatus for aligning structures are provided. One of the apparatus includes a first communication module including: a printed circuit board, one or more integrated circuit packages mounted on the printed circuit board, and one or more magnets positioned relative to the one or more integrated circuit packages, wherein the one or more magnets are configured to attractively couple the first communication module to a second communication module positioned in proximity to the first communication module.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: August 14, 2018
    Assignee: Keyssa Licensing, Inc.
    Inventors: Stephen Robert Venuti, Steve Novak
  • COMMUNICATION MODULE ALIGNMENT
    Publication number: 20170110229
    Abstract: Systems, and apparatus for aligning structures are provided. One of the apparatus includes a first communication module including: a printed circuit board, one or more integrated circuit packages mounted on the printed circuit board, and one or more magnets positioned relative to the one or more integrated circuit packages, wherein the one or more magnets are configured to attractively couple the first communication module to a second communication module positioned in proximity to the first communication module.
    Type: Application
    Filed: October 16, 2015
    Publication date: April 20, 2017
    Applicant: Keyssa Licensing, Inc.
    Inventors: Stephen Robert Venuti, Steve Novak
  • Mailbox
    Patent number: D985877
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: May 9, 2023
    Inventor: Robert Venuti