Patents by Inventor Robert Vinson Burress

Robert Vinson Burress has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6399426
    Abstract: A flip-chip device and process for fabricating the device employs a multilayer encapsulant that includes a first portion encapsulant having a coefficient of thermal expansion of at most 30 ppm/° C. and an elastic modulus of 2-20 GPa and a second portion comprising a polymer flux having a coefficient of thermal expansion that may exceed 30 ppm/° C.
    Type: Grant
    Filed: September 7, 2001
    Date of Patent: June 4, 2002
    Inventors: Miguel Albert Capote, Xiaoqi Zhu, Robert Vinson Burress, Yong-Joon Lee
  • Publication number: 20020031868
    Abstract: A flip-chip device and process for fabricating the device employs a multilayer encapsulant that includes a first portion encapsulant having a coefficient of thermal expansion of at most 30 ppm/° C. and an elastic modulus of 2-20 GPa and a second portion comprising a polymer flux having a coefficient of thermal expansion that may exceed 30 ppm/° C.
    Type: Application
    Filed: September 7, 2001
    Publication date: March 14, 2002
    Inventors: Miguel Albert Capote, Xiaoqi Zhu, Robert Vinson Burress, Yong-Joon Lee
  • Patent number: 6335571
    Abstract: A flip-chip device and process for fabricating the device employs a multilayer encapsulant that includes a first portion encapsulant having a coefficient of thermal expansion of at most 30 ppm/° C. and an elastic modulus of 2-20 GPa and a second portion comprising a polymer flux having a coefficient of thermal expansion that may exceed 30 ppm/° C.
    Type: Grant
    Filed: March 2, 2000
    Date of Patent: January 1, 2002
    Assignee: Miguel Albert Capote
    Inventors: Miguel Albert Capote, Xiaoqi Zhu, Robert Vinson Burress, Yong-Joon Lee