Abstract: Embodiments of the present disclosure generally relate to optical devices, and more specifically, protective coatings for optical devices and methods for preparing protective coatings on optical devices and other devices. In one or more embodiments, a method for protecting a photoresist on a workpiece is provided and includes depositing a photoresist layer on a first surface of a substrate, and depositing a protective coating on the photoresist layer disposed on the first surface, wherein the protective coating contains a water-soluble polymeric material. Thereafter, the method includes exposing a second surface of the substrate to one or more fabrication processes, where the first surface is covered by the photoresist layer and the protective coating, and the second surface is uncovered. Thereafter, the method further includes removing the protective coating by at least partially dissolving the water-soluble polymeric material with a removal solution containing water or an aqueous solution.

Abstract: Technology is disclosed herein that the enhances the measurability of on-chip temperature in a cryogenic quantum computing environment. In an implementation, transceiver circuitry sends a probe signal through a target device. A lumped-element resonator device that is proximate to the surface of the target device interacts with the probe signal and modulates the probe signal. Processing circuitry reads the probe signal through the target device, and responsively measures the resonance frequency of the lumped-element resonator device. The processing circuitry correlates the measured resonance frequency with a temperature and responsively determines the temperature of the target device.

Abstract: A method includes receiving a gas or gas mixture through a flow sensor. A flow velocity, volumetric, or mass flow are determined. The method also includes determining a sound velocity of the gas or gas mixture by an ultrasonic sensor. A density of the gas or gas mixture is correlated from the sound velocity. The method also includes positioning a microthermal sensor in an area with less flow or no flow of the gas or gas mixture. A thermal conductivity and thermal diffusivity of the gas or gas mixture at the one or more temperatures is determined. The method also includes connecting a processor to the microthermal sensor to calculate an energy of the gas or gas mixture based on a calorific value, the temperature and the volume or mass flow. Specific quantities for gas quality are correlated.

Abstract: Technology is disclosed herein that the enhances the measurability of on-chip temperature in a cryogenic quantum computing environment. In an implementation, transceiver circuitry sends a probe signal through a target device. A lumped-element resonator device that is proximate to the surface of the target device interacts with the probe signal and modulates the probe signal. Processing circuitry reads the probe signal through the target device, and responsively measures the resonance frequency of the lumped-element resonator device. The processing circuitry correlates the measured resonance frequency with a temperature and responsively determines the temperature of the target device.

Abstract: A display device is disclosed that includes a backlight comprising light-emitting diodes. The disclosed display device includes a liquid crystal panel configured to control transmission of light from the backlight to a viewer. The display device also includes one or more optical films that incorporate one or more light conversion materials.

Abstract: A display device is disclosed that includes a backlight comprising light-emitting diodes. The disclosed display device includes a liquid crystal panel configured to control transmission of light from the backlight to a viewer. The display device also includes one or more optical films that incorporate one or more light conversion materials.

Abstract: Embodiments of the invention generally include apparatus and methods for depositing nanowires in a predetermined pattern during an electrospinning process. An apparatus includes a nozzle for containing and ejecting a deposition material, and a voltage source coupled to the nozzle to eject the deposition material. One or more electric field shaping devices are positioned to shape the electric field adjacent to a substrate to control the trajectory of the ejected deposition material. The electric field shaping device converges an electric field at a point near the surface of the substrate to accurately deposit the deposition material on the substrate in a predetermined pattern. The methods include applying a voltage to a nozzle to eject an electrically-charged deposition material towards a substrate, and shaping one or more electric fields to control the trajectory of the electrically-charged deposition material. The deposition material is then deposited on the substrate in a predetermined pattern.

Abstract: A system for remote device management includes in a network an auto-configuration server managing device, at least one database, and a plurality of auto-configuration servers. The auto-configuration server managing device and the database are coupled in a communicative connection. The database holds information for identification of electronic devices. The auto-configuration server managing device is arranged for communication with a manageable electronic device over the network. The auto-configuration server manager is further being arranged for: receiving a request from the manageable electronic device for configuration data, determining an identification of the manageable electronic device by comparing the request with the information for identification of electronic devices of the database, determining an identification of an auto-configuration server from the plurality of auto-configuration servers in accordance with the identification of the manageable electronic device.

Abstract: A system includes an emulsification device, a processed fuel tank, an emulsification recirculation line, and a control module. The emulsification device is configured to selectively receive a liquid mixture of water and hydrocarbon fuel and produce batches of emulsified fuel. The processed fuel tank is configured to selectively receive and store the emulsified fuel. The control module is configured to monitor one or more operating parameters and execute one or more operating modes. The operating modes include a bypass mode configured to provide the engine with the hydrocarbon fuel, an emulsification recirculation mode configured to continually recirculate emulsified fuel through the emulsification device and the processed fuel tank via the emulsification recirculation line, a run mode configured to operate the engine with emulsified fuel, and a suck back mode configured to return semi-stable emulsified fuel back to the processed fuel tank.

Abstract: The present invention generally relates to a thin film semiconductor device having a buffer layer formed between the semiconductor layer and one or more layers. In one embodiment, a thin film semiconductor device includes a semiconductor layer having a first work function and a first electron affinity level, a buffer layer having a second work function greater than the first work function and a second electron affinity level that is less than the first electron affinity level; and a gate dielectric layer having a third work function less than the second work function and a third electron affinity level that is greater than the second electron affinity level.

Abstract: A system includes an emulsification device, a processed fuel tank, an emulsification recirculation line, and a control module. The emulsification device is configured to selectively receive a liquid mixture of water and hydrocarbon fuel and produce batches of emulsified fuel. The processed fuel tank is configured to selectively receive and store the emulsified fuel. The control module is configured to monitor one or more operating parameters and execute one or more operating modes. The operating modes include a bypass mode configured to provide the engine with the hydrocarbon fuel, an emulsification recirculation mode configured to continually recirculate emulsified fuel through the emulsification device and the processed fuel tank via the emulsification recirculation line, a run mode configured to operate the engine with emulsified fuel, and a suck back mode configured to return semi-stable emulsified fuel back to the processed fuel tank.

Abstract: A system for remote device management includes in a network an auto-configuration server managing device, at least one database, and a plurality of auto-configuration servers. The auto-configuration server managing device and the database are coupled in a communicative connection. The database holds information for identification of electronic devices. The auto-configuration server managing device is arranged for communication with a manageable electronic device over the network. The auto-configuration server manager is further being arranged for: receiving a request from the manageable electronic device for configuration data, determining an identification of the manageable electronic device by comparing the request with the information for identification of electronic devices of the database, determining an identification of an auto-configuration server from the plurality of auto-configuration servers in accordance with the identification of the manageable electronic device.

Abstract: A system for remote device management includes in a network an auto-configuration server managing device, at least one database, and a plurality of auto-configuration servers. The auto-configuration server managing device and the database are coupled in a communicative connection. The database holds information for identification of electronic devices. The auto-configuration server managing device is arranged for communication with a manageable electronic device over the network. The auto-configuration server manager is further being arranged for: receiving a request from the manageable electronic device for configuration data, determining an identification of the manageable electronic device by comparing the request with the information for identification of electronic devices of the database, determining an identification of an auto-configuration server from the plurality of auto-configuration servers in accordance with the identification of the manageable electronic device.

Abstract: Embodiments of the invention generally provide a silicon-based photovoltaic (PV) device containing a high work-function (HWF) buffer layer disposed between a transparent conductive oxide (TCO) layer and a p-type silicon-based layer of a p-i-n junction. The PV device generally has a transparent substrate, a first TCO layer disposed on the transparent substrate, a HWF buffer layer disposed on the first TCO layer, a p-i-n junction disposed on the high work-function buffer layer, a second TCO layer disposed on the n-type silicon-based layer, and a metallic reflective layer disposed on the second TCO layer. The p-i-n junction contains an intrinsic layer disposed between a p-type silicon-based layer and an n-type silicon-based layer, and the p-type silicon-based layer is in contact with the HWF buffer layer.

Abstract: Embodiments of the invention generally include apparatus and methods for depositing nanowires in a predetermined pattern during an electrospinning process. An apparatus includes a nozzle for containing and ejecting a deposition material, and a voltage source coupled to the nozzle to eject the deposition material. One or more electric field shaping devices are positioned to shape the electric field adjacent to a substrate to control the trajectory of the ejected deposition material. The electric field shaping device converges an electric field at a point near the surface of the substrate to accurately deposit the deposition material on the substrate in a predetermined pattern. The methods include applying a voltage to a nozzle to eject an electrically-charged deposition material towards a substrate, and shaping one or more electric fields to control the trajectory of the electrically-charged deposition material. The deposition material is then deposited on the substrate in a predetermined pattern.

Abstract: A system for remote device management includes in a network an auto-configuration server managing device, at least one database, and a plurality of auto-configuration servers. The auto-configuration server managing device and the database are coupled in a communicative connection. The database holds information for identification of electronic devices. The auto-configuration server managing device is arranged for communication with a manageable electronic device over the network. The auto-configuration server manager is further being arranged for: receiving a request from the manageable electronic device for configuration data, determining an identification of the manageable electronic device by comparing the request with the information for identification of electronic devices of the database, determining an identification of an auto-configuration server from the plurality of auto-configuration servers in accordance with the identification of the manageable electronic device.

Abstract: The present invention generally includes an apparatus and process of forming a conductive layer on a surface of a host substrate, which can be directly used to form a portion of an electronic device. More specifically, one or more of the embodiments disclosed herein include a process of forming a conductive layer on a surface of a substrate using an electrospinning type deposition process. Embodiments of the conductive layer forming process described herein can be used to reduce the number of processing steps required to form the conductive layer, improve the electrical properties of the formed conductive layer and reduce the conductive layer formation process complexity over current state-of-the-art conductive layer formation techniques. Typical electronic device formation processes that can benefit from one or more of the embodiments described herein include, but are not limited to processes used to form solar cells, electronic visual display devices and touchscreen type technologies.

Abstract: A system for remote device management includes in a network an auto-configuration server managing device, at least one database, and a plurality of auto-configuration servers. The auto-configuration server managing device and the database are coupled in a communicative connection. The database holds information for identification of electronic devices. The auto-configuration server managing device is arranged for communication with a manageable electronic device over the network. The auto-configuration server manager is further being arranged for: receiving a request from the manageable electronic device for configuration data, determining an identification of the manageable electronic device by comparing the request with the information for identification of electronic devices of the database, determining an identification of an auto-configuration server from the plurality of auto-configuration servers in accordance with the identification of the manageable electronic device.

Abstract: The present invention generally relates to a thin film semiconductor device having a buffer layer formed between the semiconductor layer and one or more layers. In one embodiment, a thin film semiconductor device includes a semiconductor layer having a first work function and a first electron affinity level, a buffer layer having a second work function greater than the first work function and a second electron affinity level that is less than the first electron affinity level; and a gate dielectric layer having a third work function less than the second work function and a third electron affinity level that is greater than the second electron affinity level.

Abstract: Embodiments of the invention generally relate to solar cell devices and methods for manufacturing such solar cell devices. In one embodiment, a method for forming a solar cell device includes depositing a conversion layer over a first surface of a substrate, depositing a first transparent conductive oxide layer over a second surface of the substrate that is opposite the first surface, depositing a first p-doped silicon layer over the first transparent conductive oxide layer, depositing a first intrinsic silicon layer over the first p-doped silicon layer, and depositing a first n-doped silicon layer over the first intrinsic silicon layer. The method further includes depositing a second transparent conductive oxide layer over the first n-doped silicon layer, and depositing an electrically conductive contact layer over the second transparent conductive oxide layer.