Abstract: Disclosed herein are integrated circuit (IC) package lids with polymer features, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A foot or rib of the lid may include a polymer material.

Abstract: A wheelchair lift having a horizontally disposed wheelchair supporting platform and a vertically disposed frame member positioned adjacent to one of the walls of the stairwell. The frame member is connected to a guide rail mounted on said side wall via a sub-frame which is rotatably fixed to the frame member and which is provided with rollers for engagement with the guide rail. The frame member also including vertically and horizontally adjustable drive and idler pinions, the adjustment of the pinions and the rotatable adjustment of the sub-frame permitting use of the wheelchair lift in stairwells of varying inclinations. Also, the frame member being symmetrical in the vertical plane to thereby permit the wheelchair lift assembly to be used with a left hand as well as a right hand guide rail.