Abstract: An apparatus and method for the evaporation and deposition of materials onto a substrate. A source material may be attached to a rope filament inside a vacuum chamber. A mechanism may be controlled for heating the rope filament and evaporating the source material. Parts for coating may be loaded into a part carrier. A motor mechanism may be controlled for rotating the part carrier. The evaporated source material may be deposited on the parts in the part carrier. The rate of the deposition may be controlled in part by controlling the power source.

Abstract: In an apparatus for initial ion cleaning, vapor metal deposition and protective coating of objects by vacuum deposition, an improved high voltage high current feedthru fitting with improved anti-fouling arc-resistant characteristics. The apparatus includes a vacuum chamber for receiving the objects which are held on a movable rack or support. A metal such as aluminum is vaporized centrally in the chamber in a well known fashion after the chamber has been substantially evacuated of air molecules for uniform vapor deposition of the metal atop exposed surfaces of the objects. The improved feedthru fitting is connected through a wall of an elongated housing which is connected over an elongated opening formed through a chamber side wall. An elongated conductive preferably aluminum rod is disposed within the housing along the opening into the chamber interior generally coextensive with two apertured delivery tubes or members positioned within the housing.

Abstract: A sputter coating apparatus for depositing a thin uniform material coating onto exposed surfaces of objects. The apparatus includes a vacuum chamber having one or more sealably closable doors through which objects treated by sputter coating are loaded into and removed therefrom and a support positionable within the chamber for supporting the objects to be sputter coated. A vacuum source establishes a vacuum in the chamber when the door is closed and the objects are held by the support within the chamber. A sputtering target formed of a material to be sputter coated onto the objects is operably connected within the chamber and spaced apart from the objects. A process gas inlet is operably connected to introduce a process gas such as argon or nitrous oxide into said chamber after a vacuum is established.