Patents by Inventor Robert W. Courtenay

Robert W. Courtenay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Assembly and method for modified bus bar with Kapton™ tape or insulative material on LOC packaged part
    Patent number: 6885087
    Abstract: A semiconductor device is formed from a die and a lead frame having one or more bus bars. Portions of the bus bars are overlain with an electrically insulative material while leaving bonding areas unobstructed, whereby bond wires which span the bus bar(s) may be bonded with a shorter wire and a lower loop, without the danger of shorting to the bus bar(s). The incidence of harmful wire sweep in the encapsulation step is also reduced.
    Type: Grant
    Filed: February 5, 2003
    Date of Patent: April 26, 2005
    Assignee: Micron Technology, Inc.
    Inventor: Robert W. Courtenay
  • Assembly and method for modified bus bar with Kapton tape or insulative material on LOC packaged part
    Publication number: 20030143829
    Abstract: A semiconductor device is formed from a die and a lead frame having one or more bus bars. Portions of the bus bars are overlain with an electrically insulative material while leaving bonding areas unobstructed, whereby bond wires which span the bus bar(s) may be bonded with a shorter wire and a lower loop, without the danger of shorting to the bus bar(s). The incidence of harmful wire sweep in the encapsulation step is also reduced.
    Type: Application
    Filed: February 5, 2003
    Publication date: July 31, 2003
    Inventor: Robert W. Courtenay
  • Assembly and method for modified bus bar with Kapton™ tape or insulative material in LOC packaged part
    Patent number: 6580157
    Abstract: A semiconductor device is formed from a die and a lead frame having one or more bus bars. Portions of the bus bars are overlain with an electrically insulative material while leaving bonding areas unobstructed, whereby bond wires which span the bus bar(s) may be bonded with a shorter wire and a lower loop, without the danger of shorting to the bus bar(s). The incidence of harmful wire sweep in the encapsulation step is also reduced.
    Type: Grant
    Filed: April 6, 2001
    Date of Patent: June 17, 2003
    Assignee: Micron Technology, Inc.
    Inventor: Robert W. Courtenay
  • Modified bus bar with kaptonTM tape or insulative material on loc packaged part
    Publication number: 20010050417
    Abstract: A semiconductor device is formed from a die and a lead frame having one or more bus bars. Portions of the bus bars are overlain with an electrically insulative material while leaving bonding areas unobstructed, whereby bond wires which span the bus bar(s) may be bonded with a shorter wire and a lower loop, without the danger of shorting to the bus bar(s). The incidence of harmful wire sweep in the encapsulation step is also reduced.
    Type: Application
    Filed: April 6, 2001
    Publication date: December 13, 2001
    Inventor: Robert W. Courtenay
  • Modified bus bar with Kapton tape or insulative material on LOC packaged part
    Patent number: 6255720
    Abstract: A semiconductor device is formed from a die and a lead frame having one or more bus bars. Portions of the bus bars are overlain with an electrically insulative material while leaving bonding areas unobstructed, whereby bond wires which span the bus bar(s) may be bonded with a shorter wire and a lower loop, without the danger of shorting to the bus bar(s). The incidence of harmful wire sweep in the encapsulation step is also reduced.
    Type: Grant
    Filed: April 30, 1998
    Date of Patent: July 3, 2001
    Assignee: Micron Technology, Inc.
    Inventor: Robert W. Courtenay
  • Modified bus bar with Kapton.TM. tape or insulative material on LOC packaged part
    Patent number: 5780923
    Abstract: A semiconductor device is formed from a die and a lead frame having one or more bus bars. Portions of the bus bars are overlain with an electrically insulative material while leaving bonding areas unobstructed, whereby bond wires which span the bus bar(s) may be bonded with a shorter wire and a lower loop, without the danger of shorting to the bus bar(s). The incidence of harmful wire sweep in the encapsulation step is also reduced.
    Type: Grant
    Filed: June 10, 1997
    Date of Patent: July 14, 1998
    Assignee: Micron Technology, Inc.
    Inventor: Robert W. Courtenay
  • Lead frame holding device
    Patent number: 4923294
    Abstract: A device useful to store transport objects retained thereon, and to be retained by the adjustable stage of a microscope for viewing under the microscope. A spring-loaded movable bracket retains the object, such as a lead frame comprising a plurality of semiconductor chips dice, on a planar surface. The movable bracket is affixed to a rod which extends through the device and which manipulates the movable bracket from an open loaded position to a closed position with the object held securely on the device.
    Type: Grant
    Filed: October 20, 1988
    Date of Patent: May 8, 1990
    Assignee: Micron Technology, Inc.
    Inventor: Robert W. Courtenay