Abstract: A new apparatus and method for dynamically absorbing resonant vibration in jet engine blades and other rotating turbomachine components over all engine speeds is disclosed. A distributed pendulum (a pendulum having its axis of motion inside its body instead of at an end) is mounted inside a jet engine blade to function as a centrifugal pendulum. A centrifugal pendulum can be tuned so that its natural frequency linearly tracks the rotational speed of the engine or other turbomachine in which it is mounted and can absorb resonant vibrations from turbomachine components whenever the frequency of a source of vibratory excitation from a so-called speed line of the turbomachine coincides with a resonant frequency of the component. The equations of motion of a distributed pendulum are derived to show that a distributed pendulum small enough to fit inside a turbomachine component can be tuned to track a turbomachine speed line by adjusting its mass distribution about its axis of motion.

Abstract: An apparatus and method for determining the dynamic response of a physical structure is disclosed. A single sheet of a piezoelectric polymer film, preferably polyvinylidene fluoride, or PVDF, is coated on one side with a thin layer of conductive material to serve as a ground electrode. The other side of the sheet is coated with a thin layer or conductive material in a non-contiguous pattern of individual electrodes defining an array of discrete piezoelectric transducers. Sensor leads are connected to each individual electrode and lead to a signal processor which includes associated software for determining from the processed electrical signals relative strain amplitudes of the surface area of a physical structure onto which the sheet is attached. The resulting output can be used to record strain time histories for later processing or, more simply, to show the time-averaged, steady state strain response of a structure.

Abstract: A single wafer processor supports a semiconductor wafer having at least one surface that is to be subjected to contact with a fluid. The equipment includes a portable module including a gripper assembly that is rotatable about the axis of a portable housing and is capable of mechanically engaging or disengaging the edge of an individual wafer. The portable module is complementary to a receiving base having an open bowl provided with liquid jets for discharging processing liquids or reagents in parallel streams directed toward the outer surface of a rotating wafer. The bowl can also be filled with liquid for immersion treatment of a wafer, which can be held stationary or rotated at slow speeds. The portable unit is moved between base units by a robotic arm. All elements associated with holding of the wafer are physically shielded to minimize wafer contamination from environmental contact.

Abstract: A single wafer processor supports a semiconductor wafer having at least one surface that is to be subjected to contact with a fluid. The equipment includes a portable module including a gripper assembly that is rotatable about the axis of a portable housing and is capable of mechanically engaging or disengaging the edge of an individual wafer. The portable module is complementary to a receiving base having an open bowl provided with liquid jets for discharging processing liquids or reagents in parallel streams directed toward the outer surface of a rotating wafer. The bowl can also be filled with liquid for immersion treatment of a wafer, which can be held stationary or rotated at slow speeds. The portable unit is moved between base units by a robotic arm. All elements associated with holding of the wafer are physically shielded to minimize wafer contamination from environmental contact.

Abstract: A single wafer processor supports a semiconductor wafer having at least one surface that is to be subjected to contact with a fluid. The equipment includes a portable module including a gripper assembly that is rotatable about the axis of a portable housing and is capable of mechanically engaging or disengaging the edge of an individual wafer. The portable module is complementary to a receiving base having an open bowl provided with liquid jets for discharging processing liquids or reagents in parallel streams directed toward the outer surface of a rotating wafer. The bowl can also be filled with liquid for immersion treatment of a wafer, which can be held stationary or rotated at slow speeds. The portable unit is moved between base units by a robotic arm. All elements associated with holding of the wafer are physically shielded to minimize wafer contamination from environmental contact.