Patents by Inventor Robert W. Guernsey, Jr.

Robert W. Guernsey, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for cooling an equipment enclosure through closed-loop liquid-assisted air cooling in combination with direct liquid cooling
    Patent number: 7486513
    Abstract: A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.
    Type: Grant
    Filed: September 27, 2007
    Date of Patent: February 3, 2009
    Assignee: International Business Machines Corporation
    Inventors: Shawn A. Hall, Shurong Tian, Paul W. Coteus, John P. Karidis, Evan G. Colgan, Robert W. Guernsey, Jr.
  • Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling
    Patent number: 7342789
    Abstract: A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.
    Type: Grant
    Filed: June 29, 2006
    Date of Patent: March 11, 2008
    Assignee: International Business Machines Corporation
    Inventors: Shawn A. Hall, Shurong Tian, Paul W. Coteus, John P. Karidis, Evan G. Colgan, Robert W. Guernsey, Jr.