Abstract: Embodiments in the present invention provide a system and method of joining structural members. This method involves aligning the first structural member to a metallic substrate when the first structural member has at least one tapered hole or cavity. A metallic or other like material suitable to cold spraying technology is deposited into the tapered cavity to form a shaped or tapered fastener bonded to the metallic substrate. The shape of the fastener secures the first structural member to the metallic substrate. Additionally, a protective insert may be placed within the shaped or tapered cavity to protect the first structural member during hoe cold spraying deposition when the first structural member is a composite material or other like material susceptible to erosion during the cold spraying technique.

Abstract: A method for joining a first structural member and a metallic substrate is provided. This method involves drawing projections from a metallic substrate using a Co-Meld or other like process. Individual plies of composite materials may be laid upon the metallic substrate and projections. These projections penetrate the individual ply or layers of the composite material. A mechanical feature that serves as a retaining device may be located at the distal end of the projections in order to prevent separation of the composite materials from the metallic substrate. The composite materials may be infused with a resin or other material to complete the formation of the composite material. Additionally, other layers of composite material may be placed over the mechanical features located at the distal ends.

Abstract: A structure for providing an enhanced heat transfer capability in a circuit board having electronic components and which is at least in part cooled by a gas flowing around the board. The enhanced heat transfer structure includes thermally conductive fibers attached at a first end to an exterior surface of the circuit board and jutting out generally perpendicular to the exterior surface. These fibers are used to conduct heat from the circuit board and transfer it to the gas. The fibers are attached the circuit board by electrostatic fiber flocking methods. It is preferred that these thermally conductive fibers are carbon fibers. The fibers can be attached to the exterior surface of the circuit board by a layer of adhesive. The fibers also do not necessarily have to be attached to the entire circuit board. They may be attached to only a portion of it, such as to temperature sensitive electronic board components.

Abstract: A structure for providing an enhanced heat transfer capability in a circuit board having electronic components and which is at least in part cooled by a gas flowing around the board. The enhanced heat transfer structure includes thermally conductive fibers attached at a first end to an exterior surface of the circuit board and jutting out generally perpendicular to the exterior surface. These fibers are used to conduct heat from the circuit board and transfer it to the gas. The fibers are attached the circuit board by electrostatic fiber flocking methods. It is preferred that these thermally conductive fibers are carbon fibers. The fibers can be attached to the exterior surface of the circuit board by a layer of adhesive. The fibers also do not necessarily have to be attached to the entire circuit board. They may be attached to only a portion of it, such as to temperature sensitive electronic board components.

Abstract: A method and apparatus for producing a reinforced composite prepreg material comprising the steps of aligning discontinuous fibers by use of a strong electric field while simultaneously inserting the fibers through a mesh screen and into a ply or plies of fiber reinforced polymer matrix composite in an uncured state in a direction normal to the surface of the composite material. After the fibers are attached in the ply of fiber reinforced polymer matrix composite, the aligned fibers are forced through the composite material by applying a gentle pressure to the top of the conductive fibers while simultaneously being guided by the mesh screen. After the insertion process has been completed, the mesh screen is lifted vertically away from the composite material and any unaligned fibers are simultaneously removed. The newly formed reinforced prepreg composite films are then stacked on top of each other and pressurized and cured in an autoclave or press to produce an improved composite laminate.

Abstract: A structure for providing an enhanced heat transfer capability in a circuit board having electronic components and which is at least in part cooled by a gas flowing around the board. The enhanced heat transfer structure includes thermally conductive fibers attached at a first end to at least a portion of the exterior surfaces of the circuit board and/or electronic components thereof. The fibers extend out from the aforementioned exterior surfaces in a generally perpendicular direction, and are used to conduct heat from the circuit board and/or electronic components, and transfer it to the surrounding gas. Electrostatic fiber flocking methods are employed to attached the fibers in the aforementioned perpendicular orientation. It is also preferred that these thermally conductive fibers are carbon fibers, and attached to the exterior surface of the circuit board by a layer of adhesive.

Abstract: A method and apparatus for providing electrical conductivity between the opposing surface edges of gaps and joints in composite and metallic structures comprises fiber flocking a first and second set of conductive fibers in a direction normal to the surface edge of each side of the gap or joint. The first and second set of conductive fibers are positioned such that the conductive fibers interdigitate with respect to each other providing a compliant electrically conductive path between the opposing surface edges of the structural gaps and joints. After assembly, the defined joint or gap containing the interdigitated sets of carbon fibers may be filled with a polymer material or materials which constitute state of the art matrix materials used for conductive joints. Applications for this technology include electromagnetic shielding and low observables.

Abstract: A method for the manufacture of low cost "oriented" composite molding compounds using discontinuous fibers embedded in a resin matrix. The method involves the steps of aligning discontinuous fibers by use of a strong electric field while simultaneously inserting the fibers onto a polymer substrate comprised of an uncured resin matrix. A preferred embodiment includes the incorporation of a mesh or a glass capillary array located parallel and adjacent to the polymer substrate to further ensure fiber alignment. After the fibers are attached to the uncured resin matrix, the aligned fibers are forced to lie down parallel along the surface of the polymer substrate by mechanically forcing the fibers flat. The newly formed reinforced polymer films may then be stacked with the fibers of each ply oriented to achieve the desired mechanical properties, and then cured to produce an improved composite laminate which can be machined to form a high strength shaped member.

Abstract: An isotropic resin matrix material includes resin doped with fiberballs. Fiberballs are formed from a plurality of fibers generally radiating outward from a common node. These fibers are of sufficient numbers and separation at a distal end to form a spherical shape. The fiberballs are uniformly distributed throughout the resin. Preferably, the fibers making up the fiberballs are carbon fibers. The carbon fibers impart thermal and electrical conductivity, or dielectric loss characteristics in some configurations. These conductivity and loss characteristics are isotropic in they are the same no matter where the electrical or thermal energy is applied due to the radial structure and uniform distribution of the fiberballs. The fiberballs may also be saturated with a phase change material and encapsulated in a shell so as to impart a heat dissipation capacity to the resin matrix material.