Patents by Inventor Robert W. Lela

Robert W. Lela has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Selective wave solder apparatus
    Patent number: 5148961
    Abstract: The selective wave soldering apparatus (101) of the present invention permits wave soldering of select components on a printed circuit board. This is accomplished by narrowing the flow of solder from the wave solder apparatus and creating the proper back pressure on two sides of the flow to form the proper height wave. The back pressure is created by an extended, angled lip (102) on one side and a trough (103) on the side opposite the lip. The trough (103) is open on top and has small openings in one end to slow the flow of molten solder from the trough (103).
    Type: Grant
    Filed: December 23, 1991
    Date of Patent: September 22, 1992
    Assignee: Motorola, Inc.
    Inventors: Gary A. Humbert, Robert W. Lela