Patents by Inventor Robert W. Lottig

Robert W. Lottig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 3986992
    Abstract: This invention pertains to a one-component, low shrink molding resin system comprising a thermoplastic, branched alkyd in combination with a thermosetting dicyclopentadiene modified polyester resin. The low shrink molding resin systems are stabilized dispersions wherein the branched thermoplastic alkyd is dispersed within the dicyclopentadiene polyester resin (polyester polymer + monomer) to provide a uniform dispersion. The low shrink molding resin system can be thickened with alkaline earth and/or hydroxide thickeners suitable for use in low shrink molding compositions for producing low-profile molded parts.
    Type: Grant
    Filed: April 16, 1975
    Date of Patent: October 19, 1976
    Assignee: SCM Corporation
    Inventors: John L. Canning, Robert W. Lottig
  • Patent number: RE29555
    Abstract: This invention pertains to a one-component, low shrink molding resin system comprising a thermoplastic, branched alkyd in combination with a thermosetting dicyclopentadiene modified polyester resin. The low shrink molding resin systems are stabilized dispersions wherein the branched thermoplastic alkyd is dispersed within the dicyclopentadiene polyester resin (polyester polymer + monomer) to provide a uniform dispersion. The low shrink molding resin system can be thickened with alkaline earth and/or hydroxide thickeners suitable for use in low shrink molding compositions for producing low-profile molded parts.
    Type: Grant
    Filed: February 14, 1977
    Date of Patent: February 28, 1978
    Assignee: SCM Corporation
    Inventors: John L. Canning, Robert W. Lottig