Abstract: A precolored, water-developable, photosensitive elements comprising:(A) a support;(B) a colorant-containing layer consisting essentially of(1) a colorant, and(2) a polyvinyl alcohol binder, said binder being about 87-100% hydrolyzed and being of sufficiently high molecular weight to be film-forming; and(C) a photosensitive layer consisting essentially of:(3) a photosensitive, water-soluble, polymeric diazo resin; and(4) a polyvinyl alcohol binder, said binder being about 87-100% hydrolyzed and being of sufficiently high molecular weight to be film-forming; and(D) an adhesive layer;wherein said colorant-containing layer (B) and said photosensitive layer (C) may be combined into a single layer colorant-containing, photosensitive coating (E) which must be in contact with the adhesive layer (D) or alternatively, said colorant-containing layer (B) and said photosensitive layer (C) may be in separate but contiguous layers provided that either layer (B) or (C) must be in contact with the adhesive layer (D), and prov

Abstract: Provided are multilayer, tonable peel-apart photosensitive elements which include an esterified polyol plasticizer in the photoadherent layer, together with processes for their use for preparing pre-press color proofs.

Abstract: By the process of this invention, printed circuits are prepared containing an electrically conductive wiring trace from materials having adherent and non-adherent surface areas, e.g., printed circuit substrates bearing an imaged photoadhesive layer. Onto the adherent surface areas of the material are applied ductile metal or alloy particles, and any excess particles are removed from the non-adherent areas. The metallized areas are conjoined, e.g., with silicon carbide brush or rounded metal rod. The conjoined areas can be electrolessly plated, electroplated or soldered. Multilayer printed circuits can also be prepared by repeating these steps with additional layers of photoadhesive material adhered to underlying printed circuits.

Abstract: By the process of this invention, two layer printed circuits having conductive interconnections are prepared by applying a photoadhesive layer to a substrate bearing an electrically conductive circuit pattern, exposing the photoadhesive layer to a circuit image related to the circuit pattern to produce adherent circuit image areas having segments thereof, e.g., pad areas, overlying segments of the electrically conductive circuit pattern, applying metal, alloy or plating catalyst powder, e.g., copper, to the adherent image areas, exposing the metallized or catalytic circuit pattern to an image of the overlying segments of the previous circuit patterns, removing the overlying segment areas of the photoadhesive layer with a suitable solvent, and treating the metallized surface by plating, e.g., electrolessly plating, or by soldering. Multilayer printed circuits can also be prepared by repeating these steps with additional layers of photoadhesive material adhered to underlying printed circuits.