Abstract: A lithographic pattern includes a first scribe along an edge of a die region, and a second scribe along an opposing edge of the die region. The first scribe includes at least a first translucent box and a second translucent box. The second scribe includes at least a first opaque box and a second opaque box defined respectively by a first translucent frame and a second translucent frame. When the lithographic pattern is stepped between fields on a wafer, the first translucent box is placed at least partially within the first opaque box, and the second translucent box is placed at least partially within the second opaque box. If a continuous ring is formed from a pair of a translucent box and an opaque box, the fields are aligned at least within an amount equal to the difference between the dimensions of that translucent box and that opaque box divided by 2.

Abstract: A test structure pattern includes a first comb having a first set of tines, and a second comb having a second set of tines of the same width and spacing as the first set of tines. When the test structure pattern is stepped between fields on a wafer, the first comb and the second comb at least partially overlap on photoresist over a scribe lane between the fields. When the photoresist is developed, the overlap of the first comb and the second comb generates a metal comb. Electrical continuity is checked for the metal tines of the metal comb to determine the misalignment of the fields.

Abstract: A lithographic pattern includes a first scribe along an edge of a die region, and a second scribe along an opposing edge of the die region. The first scribe includes at least a first translucent box and a second translucent box. The second scribe includes at least a first opaque box and a second opaque box defined respectively by a first translucent frame and a second translucent frame. When the lithographic pattern is stepped between fields on a wafer, the first translucent box is placed at least partially within the first opaque box, and the second translucent box is placed at least partially within the second opaque box. If a continuous ring is formed from a pair of a translucent box and an opaque box, the fields are aligned at least within an amount equal to the difference between the dimensions of that translucent box and that opaque box divided by 2.

Abstract: A test structure pattern includes a first comb having a first set of tines, and a second comb having a second set of tines of the same width and spacing as the first set of tines. When the test structure pattern is stepped between fields on a wafer, the first comb and the second comb at least partially overlap on photoresist over a scribe lane between the fields. When the photoresist is developed, the overlap of the first comb and the second comb generates a metal comb. Electrical continuity is checked for the metal tines of the metal comb to determine the misalignment of the fields.

Abstract: A test structure pattern includes a first comb having a first set of tines, and a second comb having a second set of tines of the same width and spacing as the first set of tines. When the test structure pattern is stepped between fields on a wafer, the first comb and the second comb at least partially overlap on photoresist over a scribe lane between the fields. When the photoresist is developed, the overlap of the first comb and the second comb generates a metal comb. Electrical continuity is checked for the metal tines of the metal comb to determine the misalignment of the fields.

Abstract: A test structure pattern includes a first comb, a second comb, and a serpentine line. The first comb includes a first set of tines of the same orientation. The second comb includes a second set of tines of the same orientation that are interdigitated with the first set of tines. The serpentine line runs between the interdigitated tines of the first metal comb and the second metal comb. The test structure pattern forms a first metal comb, a second metal comb, and a serpentine metal line on a die. Print quality and resolution is tested by checking for electrical continuity in the serpentine metal line and bridging between the serpentine metal line and one of the first metal comb and the second metal comb.

Abstract: A test structure pattern includes a first comb, a second comb, and a serpentine line. The first comb includes a first set of tines of the same orientation. The second comb includes a second set of tines of the same orientation that are interdigitated with the first set of tines. The serpentine line runs between the interdigitated tines of the first metal comb and the second metal comb. The test structure pattern forms a first metal comb, a second metal comb, and a serpentine metal line on a die. Print quality and resolution is tested by checking for electrical continuity in the serpentine metal line and bridging between the serpentine metal line and one of the first metal comb and the second metal comb.

Abstract: A test structure pattern includes a first comb, a second comb, and a serpentine line. The first comb includes a first set of tines of the same orientation. The second comb includes a second set of tines of the same orientation that are interdigitated with the first set of tines. The serpentine line runs between the interdigitated tines of the first metal comb and the second metal comb. The test structure pattern forms a first metal comb, a second metal comb, and a serpentine metal line on a die. Print quality and resolution is tested by checking for electrical continuity in the serpentine metal line and bridging between the serpentine metal line and one of the first metal comb and the second metal comb.

Abstract: A test structure pattern includes a first comb, a second comb, and a serpentine line. The first comb includes a first set of tines of the same orientation. The second comb includes a second set of tines of the same orientation that are interdigitated with the first set of tines. The serpentine line runs between the interdigitated tines of the first metal comb and the second metal comb. The test structure pattern forms a first metal comb, a second metal comb, and a serpentine metal line on a die. Print quality and resolution is tested by checking for electrical continuity in the serpentine metal line and bridging between the serpentine metal line and one of the first metal comb and the second metal comb.

Abstract: A lithographic pattern includes a first scribe along an edge of a die region, and a second scribe along an opposing edge of the die region. The first scribe includes at least a first translucent box and a second translucent box. The second scribe includes at least a first opaque box and a second opaque box defined respectively by a first translucent frame and a second translucent frame. When the lithographic pattern is stepped between fields on a wafer, the first translucent box is placed at least partially within the first opaque box, and the second translucent box is placed at least partially within the second opaque box. If a continuous ring is formed from a pair of a translucent box and an opaque box, the fields are aligned at least within an amount equal to the difference between the dimensions of that translucent box and that opaque box divided by 2.

Abstract: A test structure pattern includes a first comb having a first set of tines, and a second comb having a second set of tines of the same width and spacing as the first set of tines. When the test structure pattern is stepped between fields on a wafer, the first comb and the second comb at least partially overlap on photoresist over a scribe lane between the fields. When the photoresist is developed, the overlap of the first comb and the second comb generates a metal comb. Electrical continuity is checked for the metal tines of the metal comb to determine the misalignment of the fields.