Abstract: In one embodiment an electronic device comprises a housing having a first section comprising a display and a second section comprising a keyboard coupled to the first section by a hinge assembly and an automatic hinge opening assembly for the housing. The automat hinge opening assembly comprises a hinge pin assembly mountable to the first section of the housing of the electronic device a pin rotatable about an axis between a first position and a second position and a hinge plate coupled to the pin and connectable to a hinge which connects the first section of the housing to a second section of the housing, and at least one torsion member coupled to the pin to apply a torque to the pin, wherein the torsion member is to store potential energy when the first section of the housing and the second section of the housing are in a closed position. Other embodiments may be described.

Abstract: In one embodiment an electronic device comprises a housing having a first section comprising a display and a second section comprising a keyboard coupled to the first section by a hinge assembly and an automatic hinge opening assembly for the housing. The automat hinge opening assembly comprises a hinge pin assembly mountable to the first section of the housing of the electronic device a pin rotatable about an axis between a first position and a second position and a hinge plate coupled to the pin and connectable to a hinge which connects the first section of the housing to a second section of the housing, and at least one torsion member coupled to the pin to apply a torque to the pin, wherein the torsion member is to store potential energy when the first section of the housing and the second section of the housing are in a closed position. Other embodiments may be described.

Abstract: Techniques for precision testing of thermal interface materials are described. An apparatus may include multiple anvils each having multiple sensors disposed along its axis. A thermal interface material may be disposed between the anvils. A control module may be communicatively coupled to said sensors and arranged to receive temperature readings from the multiple sensors to form a temperature gradient, determine a surface temperature for each anvil based on the temperature gradient, determine a heat flux through the thermal interface material based on the surface temperature, and determine a resistance value for the thermal interface material based on the heat flux. Other embodiments are described and claimed.

Abstract: Techniques for precision testing of thermal interface materials are described. An apparatus may include multiple anvils each having multiple sensors disposed along its axis. A thermal interface material may be disposed between the anvils. A control module may be communicatively coupled to said sensors and arranged to receive temperature readings from the multiple sensors to form a temperature gradient, determine a surface temperature for each anvil based on the temperature gradient, determine a heat flux through the thermal interface material based on the surface temperature, and determine a resistance value for the thermal interface material based on the heat flux. Other embodiments are described and claimed.