Abstract: Plate-shaped fire-resistant elements in a sandwich construction have at least three layers connected with one another and resist fire from a front and a back side. The fire-resistant elements are intended in particular for a ceiling or a wall of a building. The elements have a light weight, a high mechanical stability, and can be easily and inexpensively manufactured and installed in a building. The fire-resistant elements have two outer layers and a center layer lying therebetween in the form of a plate, whereby the edge area of the two outer layers is enclosed on at least two oppositely lying sides. Each side has an edge section and the layers are connected with one another. The outer layers have expandable glass granulate or perlite, and the center layer is constructed to prevent passage or penetration of gases.

Abstract: A dimensionally stable and fireproof acoustic panel includes an underlying panel covered on one or both sides by a cover panel. The underlying panel can be produced with a cover layer on the interior side thereof. The cover layer is composed of two layers, a coarse-pored stabilizing intermediate layer which in turn is covered by a second, fine-pored outer layer, both of which are bonded to one another and to the underlying panel by a matrix of adhesive material.

Abstract: A sound-absorbing building panel for lining of the inside walls and ceilings, in particular ceiling tile, consists of a carrier panel to be arranged spaced from a wall, which carrier panel is advantageously a perforated sheet metal and to which on at least one side a sound-absorbing, microporous layer is applied. Such a building panel, which does not require an insulation layer as a backing and can, moreover, be manufactured inexpensively, has a sound-absorbing layer of granules which are surrounded on all sides by an adhesive coating. The granules are essentially designed ball-shaped and are adhesively connected together at point-like connections and to the carrier panel. The granules also have a diameter between 0.1 to 0.9 times of the hole diameter of the carrier panel.