Patents by Inventor Robert Wadell

Robert Wadell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240103073
    Abstract: Embodiments described herein may be related to apparatuses, processes, systems, and/or techniques for an enclosure, which may be referred to as a cartridge, that surrounds a semiconductor device prior to the semiconductor device being bombarded with an electron beam during operational testing. In embodiments, the enclosure may include a cooling plate that includes a thermal cooling mechanism that is thermally coupled with the semiconductor device to control the temperature of the semiconductor device during testing. The thermal cooling mechanism may include a manifold that extends through the plate through which a cooled fluid, cooled air, or some other cool material may be circulated to cool the semiconductor device. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 23, 2022
    Publication date: March 28, 2024
    Inventors: Patrick PARDY, Robert WADELL, Tewodros WONDIMU, Michael APODACA, Joshua FREIER, Amir RAVEH, Eric BRUMMER
  • Patent number: 7669428
    Abstract: Briefly described, embodiments of this disclosure, among others, include vortex vapor compression refrigeration (VCR) systems and methods of cooling.
    Type: Grant
    Filed: April 14, 2005
    Date of Patent: March 2, 2010
    Assignee: Georgia Tech Research Corporation
    Inventors: Andrei G. Federov, Robert Wadell, Stephane Launay
  • Patent number: 7639030
    Abstract: In one embodiment, a head assembly to be adapted about a solid immersion lens includes a plurality of jets configured in a radial pattern that extends from a central portion to a substantial periphery of the head assembly. The jets may expel a liquid coolant stream to cool a semiconductor device with a radial impingement pattern so that the liquid coolant travels from a central portion of the semiconductor surface to a peripheral portion of the semiconductor surface. Other embodiments are described and claimed.
    Type: Grant
    Filed: October 15, 2007
    Date of Patent: December 29, 2009
    Assignee: Intel Corporation
    Inventor: Robert Wadell
  • Publication number: 20090095097
    Abstract: In one embodiment, a head assembly to be adapted about a solid immersion lens includes a plurality of jets configured in a radial pattern that extends from a central portion to a substantial periphery of the head assembly. The jets may expel a liquid coolant stream to cool a semiconductor device with a radial impingement pattern so that the liquid coolant travels from a central portion of the semiconductor surface to a peripheral portion of the semiconductor surface. Other embodiments are described and claimed.
    Type: Application
    Filed: October 15, 2007
    Publication date: April 16, 2009
    Inventor: Robert Wadell
  • Publication number: 20060230765
    Abstract: Briefly described, embodiments of this disclosure, among others, include vortex vapor compression refrigeration (VCR) systems and methods of cooling.
    Type: Application
    Filed: April 14, 2005
    Publication date: October 19, 2006
    Inventors: Andrei Fedorov, Robert Wadell, Stephane Launay