Abstract: A laser diode assembly contains a plurality of laser diode chips packaged closely in a row. Each laser diode chip is bonded on both P-side and N-side to first and second sub-mounts. The sub-mounts are then attached to a cooling carrier, with both bonding surfaces perpendicular to the top surface of the carrier. The direction of laser radiation is parallel to the carrier top surface, and the distance between the top of the active area of the laser diode chip and the carrier is preferably in a range of half a pitch between individual laser sources packaged in a row or preferably in a range of 0.2 mm to 1 mm to allow efficient cooling for high power operation. The sub-mounts may be electrically conductive, or they may be of insulating material at least partially covered with a conducting layer. A laser diode chip is bonded uniquely to a set of sub-mounts or may share a sub-mount with another laser diode chip.

Abstract: A method of fabricating an optical module includes attaching a lens to a platform of the optical module such that the lens remains in precise alignment with a light source (e.g., a laser diode) and a target optical fiber even after the lens is attached or fixed to the platform. The optical module includes a micro-lens assembly, comprising a bridge and a micro-lens holder holding a micro-lens. The micro-lens holder is initially to the light source to substantially optimize coupling of light into the input aperture of the optical fiber. Next, the bridge is inserted beneath the micro-lens holder on the platform. Subsequently, the bridge is fixedly attached to the platform. The micro-lens holder is realigned to the light source to substantially optimize coupling of light into the input aperture of the optical fiber and then the micro-lens holder is fixedly attached to the bridge.

Abstract: A method of aligning an optical fiber to a light source (e.g., a laser diode) in an optical assembly includes inserting a weld clip over a ferrule holding the optical fiber so that there is no gap between the ferrule and the weld clip, initially aligning the optical fiber to the laser diode, fixedly attaching the weld clip to a platform, realigning the optical fiber to the laser diode, and fixedly attaching the weld clip to the ferrule.

Abstract: A method of aligning an optical fiber to a light source (e.g., a laser diode) in an optical assembly includes inserting a weld clip over a ferrule holding the optical fiber so that there is no gap between the ferrule and the weld clip, initially aligning the optical fiber to the laser diode, fixedly attaching the weld clip to a platform, realigning the optical fiber to the laser diode, and fixedly attaching the weld clip to the ferrule.

Abstract: A method of fabricating an optical module includes attaching a lens to a platform of the optical module such that the lens remains in precise alignment with a light source (e.g., a laser diode) and a target optical fiber even after the lens is attached or fixed to the platform. The optical module includes a micro-lens assembly, comprising a bridge and a micro-lens holder holding a micro-lens. The micro-lens holder is initially to the light source to substantially optimize coupling of light into the input aperture of the optical fiber. Next, the bridge is inserted beneath the micro-lens holder on the platform. Subsequently, the bridge is fixedly attached to the platform. The micro-lens holder is realigned to the light source to substantially optimize coupling of light into the input aperture of the optical fiber and then the micro-lens holder is fixedly attached to the bridge.

Abstract: The present invention relates to a novel technique for mounting and packaging a passively aligned optical fiber to an optoelectronic device on a silicon optical bench. The silicon optical bench is thereafter mounted on a flat portion of a substantially cylindrical ferrule, preferably ceramic, and an optical fiber protruding from the cylindrical ferrule to the flat portion of the ferrule. The ferrule is toleranced to form either a single mode or multimode connection for the assembly. Thereafter, a substantially cylindrical housing tube is disposed over the assembly, the housing tube being enclosed on one side by the ceramic ferrule. An integral lead assembly, having an overmolded substantially cylindrical plug and electrical leads closes the housing tube on the opposite side of the housing tube from the ferrule. This lead assembly as stated is overmolded and has electrical leads which make contact with electrical leads disposed on the flat portion of the ceramic ferrule.

Abstract: A passively aligned high performance optoelectronic package in pigtail form which has a reduced cost over the conventional techniques of packaging by virtue of materials and alignment techniques is disclosed. The package of the present disclosure has a ferrule made of material which substantially matches the thermal characteristics of the optical bench, with the ferrule having a flat portion on one end for securing an optical fiber on a receiving group of the optical bench. The material of the ferrule is preferably kovar. Finally, passive alignment of the optoelectronic device to the fiber is effected by way of the ferrule with the flat portion of the ferrule being partially disposed in a second ferrule or sleeve prior to commitment of the sub-assembly into the final package.

Abstract: An optical subassembly for monitoring the emission of a semi-conductor laser is disclosed. The subassembly is diced from a wafer having mounted thereon the devices to be tested as well as the testing optical devices. The devices of the wafer are burned-in and those sections of the wafer having lasers that pass the burn-in testing are diced and form the subassemblies of the present invention.

Abstract: A package for an optoelectronic device comprising: a substrate, an optical fiber disposed on the substrate, a ferrule for receiving the optical fiber and having a substantially flat surface for mounting the substrate; a housing member having a first end and a second end. The ferrule is disposed in the first end and a plug member is disposed in the second end of the housing.