Abstract: An enhanced dual in line memory module (DIMM) connector includes internal conductive paths that provide access to signaling on standard conductive paths to an industry standard DIMM. The internal conductive paths are coupled in series or in parallel with the standard conductive paths through the connector. Interposer circuitry, such as control circuitry and or supplemental memory circuitry, may be incorporated on or within the connector. The interposer circuitry may include field effect transistor (FET) switching circuitry configured to selectively decouple a defective dynamic random memory (DRAM) on a DIMM from a conductive path to a memory controller and couple a substitute DRAM to the conductive paths in its place.

Abstract: An enhanced dual in line memory module (DIMM) connector includes internal conductive paths that provide access to signaling on standard conductive paths to an industry standard DIMM. The internal conductive paths are coupled in series or in parallel with the standard conductive paths through the connector. Interposer circuitry, such as control circuitry and or supplemental memory circuitry, may be incorporated on or within the connector. The interposer circuitry may include field effect transistor (FET) switching circuitry configured to selectively decouple a defective dynamic random memory (DRAM) on a DIMM from a conductive path to a memory controller and couple a substitute DRAM to the conductive paths in its place.

Abstract: A system and method for semiconductor identification chip read out is presented. A user uses a stand-alone handheld device to extract product data, which includes manufacturing process attributes, from a semiconductor device. The semiconductor device couples to the hand held device through a subset of pins, such as a power pin, a ground pin, a clock in pin, and a data out pin. When coupled, the handheld device provides a clock signal to the semiconductor device. In turn, on chip logic within the semiconductor device detects the clock signal and gathers internal product data. Once gathered, the on chip logic provides the product data to the hand held device through the data out pin for a user to view. As a result, the user may track semiconductor devices more efficiently.

Abstract: A power system couples to a multi-core processor to provide power to the processor. The power system throttles at least one of the cores of the processor when the power that the processor consumes from the power system exceeds a predetermined threshold power. The power system may reduce the rate of instruction issue by a particular core or clock gate a particular core to provide power throttling. The power system dynamically responds to variance of the actual output voltage that processor circuitry receives from the power system in comparison to an expected output voltage over time and corrects for such variance.

Abstract: A technology for supplying a power supply voltage to a microprocessor. Before normal arithmetic processing of the microprocessor, duty cycle correction process for adjusting the duty cycle of a clock signal inside the microprocessor is performed. In the duty cycle correction process for adjusting the duty cycle, the duty cycle of the clock signal is adjusted so as to minimize the power voltage at which the microprocessor is still operable.

Abstract: A system and method for semiconductor identification chip read out is presented. A user uses a stand-alone handheld device to extract product data, which includes manufacturing process attributes, from a semiconductor device. The semiconductor device couples to the hand held device through a subset of pins, such as a power pin, a ground pin, a clock in pin, and a data out pin. When coupled, the handheld device provides a clock signal to the semiconductor device. In turn, on chip logic within the semiconductor device detects the clock signal and gathers internal product data. Once gathered, the on chip logic provides the product data to the hand held device through the data out pin for a user to view. As a result, the user may track semiconductor devices more efficiently.

Abstract: In an LSSD/LBIST scan design, AC scan test coverage is enhanced with a scan chain configuration capable of selectively inverting scan-in signals. For example, one or more XOR gates are inserted in the scan chain. The XOR gates is controlled by a control signal preferably coming from a primary input such that original scan-in signals as well as inverted scan-in signals are shifted into the scan chain. The proposed configuration significantly enhances the AC test coverage for a scan chain having adjacent SRLs feeding the same cone of logic by adding a simple logic circuit such as an XOR gate between the adjacent SRLs.

Abstract: The present invention provides an apparatus and a method for testing one or more electrical components. The apparatus and method provide a CRC function that is used to calculate a CRC value for a portion of memory. The CRC value is compared with an expected CRC value to determine if the electrical component passed or failed the test.